Patents Assigned to Teraspeed Consulting Group LLC
  • Publication number: 20110102075
    Abstract: A power distribution system for integrated circuits includes methods to damp resonance between a bypass capacitor network and a power/ground cavity of the printed circuit board that (a) does not require excessive quantities of bypass/damping components or (b) does not require high plane cavity capacitance or in the alternative can insure a Q of less than 1.4 at the transition from the bypass network to the plane cavity impedance cross-over.
    Type: Application
    Filed: January 6, 2011
    Publication date: May 5, 2011
    Applicant: Teraspeed Consulting Group LLC
    Inventors: Steve Weir, Scott McMorrow
  • Publication number: 20110068878
    Abstract: A power distribution system for integrated circuits includes methods to damp resonance between a bypass capacitor network and a power/ground cavity of the printed circuit board that (a) does not require excessive quantities of bypass/damping components or (b) does not require high plane cavity capacitance or in the alternative can insure a Q of less than 1.4 at the transition from the bypass network to the plane cavity impedance cross-over.
    Type: Application
    Filed: August 5, 2010
    Publication date: March 24, 2011
    Applicant: Teraspeed Consulting Group LLC
    Inventors: Steve Weir, Scott McMorrow
  • Patent number: 7886431
    Abstract: A power distribution system for integrated circuits includes methods to damp resonance between a bypass capacitor network and a power/ground cavity of the printed circuit board that (a) does not require excessive quantities of bypass/damping components or (b) does not require high plane cavity capacitance or in the alternative can insure a Q of less than 1.4 at the transition from the bypass network to the plane cavity impedance cross-over.
    Type: Grant
    Filed: June 1, 2007
    Date of Patent: February 15, 2011
    Assignee: Teraspeed Consulting Group LLC
    Inventors: Steve Weir, Scott McMorrow
  • Patent number: 7773390
    Abstract: A power distribution system for integrated circuits includes methods to damp resonance between a bypass capacitor network and a power/ground cavity of the printed circuit board that (a) does not require excessive quantities of bypass/damping components or (b) does not require high plane cavity capacitance or in the alternative can insure a Q of less than 1.4 at the transition from the bypass network to the plane cavity impedance cross-over.
    Type: Grant
    Filed: June 1, 2007
    Date of Patent: August 10, 2010
    Assignee: Teraspeed Consulting Group LLC
    Inventors: Steve Weir, Scott McMorrow