Abstract: A method of handling and securing platelike substrates, such as wafers, is described in which a substrate is gripped between supporting elements situated opposite each other in the plane of the substrate to be applied against opposite side edges of the substrate. The gripping forces are applied through resilient means in order to limit the gripping force applied. Apparatus for gripping a substrate in accordance with this method has the supporting element or elements on one side in a fixed position and the other movable towards the substrate to apply the gripping force, the resillient means being disposed between said other element or elements and the driving means for said movement. There is also described an optical sensing system for positioning the supporting element relative to a substrate.

Abstract: An apparatus for holding and positioning a substrate or wafer cassette has a receiving plate which is adjustable on a three-point mounting and is lockable in its position of adjustment. The receiving plate carries runner receivers for initial guidance of a cassette onto the plate by engagement with guide runners on the cassette, and locking pins for the final location of the cassette by engagement with marginal strips on the base of the cassette.