Patents Assigned to The Great American Gumball Corporation
  • Patent number: 6102715
    Abstract: An adapter to connect either Type I or Type II cards into a PCMCIA compliant PC Card interface on a personal computer. A protective shutter mechanism receives both Type I and Type II cards.
    Type: Grant
    Filed: February 10, 1998
    Date of Patent: August 15, 2000
    Assignee: The Great American Gumball Corporation
    Inventor: Charles A. Centofante
  • Patent number: 5964595
    Abstract: An injection molded plastic housing for, and method of enclosing, an electrical device including placing the device between a housing including a lid member and a base member and joining the lid member and the base member to each other and to a connector attached to the enclosed device. The lid member, base member and connector each may include a means for mating to promote their joining to form an assembled plastic housing with increased structural integrity. The lid member and base member join with the connector in a substantially overlapping relationship that results in a rigid and aesthetically pleasing housing which complies with standards for PC card style devices set by, for example, CFA, PCMCIA, JEDIC, ISO, etc. The inexpensive injection molded plastic material of the housing and the limited number of parts provides for an easily automated, economical method of enclosing electrical devices for use, for example, in computer peripheral and memory applications.
    Type: Grant
    Filed: November 26, 1997
    Date of Patent: October 12, 1999
    Assignee: Great American Gumball Corporation
    Inventor: Charles A. Centofante
  • Patent number: 5833903
    Abstract: A method and apparatus for encapsulating one or more small electronic devices, including for example light-emitting diodes, mounted directly on a substrate by providing a three-dimensional formation on the substrate adjacent to the device and injection molding a thermoplastic encapsulating material to cover the device and extend over the three-dimensional formation on the substrate and wherein the encapsulating material mechanically bonds to the three-dimensional formation. A gate plate for use in injection molding a thermoplastic encapsulating material over a small electronic device mounted directly on a substrate including a cavity formed to enclose the device, and a short gate formed entirely within the gate plate having an input for receiving an encapsulating material and an output communicating with the cavity.
    Type: Grant
    Filed: December 10, 1996
    Date of Patent: November 10, 1998
    Assignee: Great American Gumball Corporation
    Inventor: Charles A. Centofante
  • Patent number: 5833785
    Abstract: An injection molded plastic housing for, and method of enclosing, an electrical device including placing the device between a housing including a lid member and a base member and joining the lid member and the base member to each other and to a connector attached to the enclosed device. The lid member, base member and connector each may include a means for mating to promote their joining to form an assembled plastic housing with increased structural integrity. The lid member and base member join with the connector in a substantially overlapping relationship that results in a rigid and aesthetically pleasing housing which complies with standards for PC card style devices set by, for example, CFA, PCMCIA, JEDIC, ISO, etc. The inexpensive injection molded plastic material of the housing and the limited number of parts provides for an easily automated, economical method of enclosing electrical devices for use, for example, in computer peripheral and memory applications.
    Type: Grant
    Filed: April 11, 1997
    Date of Patent: November 10, 1998
    Assignee: Great American Gumball Corporation
    Inventor: Charles A. Centofante