Patents Assigned to The Industry & Academic Coorporation in Chungnam National University
  • Patent number: 8400146
    Abstract: Provided is a stray field collector (SFC) pad and a bio-molecule sensing module or a biochip using the same, and more particularly, a SFC pad, in which probe or detection molecules are attached to a plurality of magnetic labels (magnetic particles or beads) and they are bonded to complementary molecules to enhance a stray field sensor signal of the magnetic labels remaining in the vicinity of the sensor, and a bio-molecule sensing module and a biochip using the same. The provided is related to qualitative as well as quantitative detection of magnetic labels, and the SFC pad which can increase an effective surface area sensitive to the magnetic labels by probe-detection molecular bond in a magnetic biosensor and collect the resultant stray field can enhance sensitivity, accuracy and resolution of the magnetic biosensor.
    Type: Grant
    Filed: February 3, 2010
    Date of Patent: March 19, 2013
    Assignee: The Industry & Academic Coorporation in Chungnam National University
    Inventors: Cheolgi Kim, Brajalal Sinha, Sunjong Oh, Jong-Ryul Jeong
  • Publication number: 20120270070
    Abstract: Disclosed are a hybrid copper alloy with high strength, high elastic modulus, high corrosion-resistance, wear resistance, and high conductivity and a method for producing the same. The hybrid copper alloy has a bi- or multi-layer structure in which (A) a copper alloy Cu (A) selected from the group consisting of Cu—Zn, Cu—Al, Cu—Ni—Zn, Cu—Ni—Si, Cu—Ni—Sn and Cu—Ni—Si—Sn is bonded to a copper alloy Cu (B) selected from the group consisting of Cu—Cr, Cu—Zr, Cu—Ag, Cu—Mg and Cu—Cr—Zr or molten alloys of a copper alloy Cu (A) and a copper alloy Cu (B) are cast in parallel such that a joint interface between these alloys is present. The hybrid copper alloy exhibits high strength, high elasticity, high corrosion resistance, abrasion resistance and high conductivity that cannot be obtained by a single copper alloy known to date.
    Type: Application
    Filed: February 7, 2012
    Publication date: October 25, 2012
    Applicant: The Industry & Academic Coorporation in Chungnam National University (IAC)
    Inventors: Sun Ig HONG, Ki Hwan OH