Abstract: Disclosed is a laser peening apparatus, including: a liquid holding head to shape and hold liquid to trap plasma on a local surface of a workpiece; and a laser irradiation head to irradiate the surface with laser through the liquid held in the liquid holding head.
Type:
Application
Filed:
October 1, 2007
Publication date:
May 8, 2008
Applicants:
FUJI JUKOGYO KABUSHIKI KAISHA, The Society of Japanese Herospace Companies