Patents Assigned to The United States of America as represented by the director of the National Aeronautics and Space Administration
  • High temperature polyimide film laminates and process for preparation thereof
    Patent number: 4543295
    Abstract: High temperature polyimide film laminates and a process for fabricating large-area, void-free polyimide laminate structures wherein multiple-ply polyimide film laminates may be constructed without decreasing the individual film strength and wherein layers of metal foil may be laminated between polyimide film layers to yield a flexible high temperature resistant structure having capabilities for use as flexible electric circuits, in aerospace applications, and the like.
    Type: Grant
    Filed: October 24, 1984
    Date of Patent: September 24, 1985
    Assignee: The United States of America as represented by the director of the National Aeronautics and Space Administration
    Inventors: Anne K. St. Clair, Terry L. St. Clair