Abstract: Provided is an ultrasonic vibration processing device which can suppress vibration of components due to an ultrasonic vibrator and can perform processing using ultrasonic vibration in a preferable manner; the ultrasonic vibration processing device includes: a housing (10); an ultrasonic vibrator (20) including a horn portion (21A) to which a tool holder (70) is detachably attached and a piezoelectric element (23), the ultrasonic vibrator having a rear end located at a node of ultrasonic vibration and being supported inside the housing (10) so as to be rotatable; a connecting portion (30) stored in the housing (10) so as to be rotatable together with the ultrasonic vibrator (20); a motor (40) connected to the connecting portion (30); and a non-contact power supply unit (50) including a primary transformer (51) and a secondary transformer (52), the primary transformer (51) being fixed to the housing (10) and including a primary coil (51B) that receives high frequency power from an external power supply, the sec
Type:
Grant
Filed:
July 17, 2018
Date of Patent:
August 16, 2022
Assignees:
KIRA CORPORATION, UNIVERSITY OF MIYAZAKI, THE UNIVERISITY OF KITAKYUSHU
Abstract: Provided is an ultrasonic vibration processing device which can suppress vibration of components due to an ultrasonic vibrator and can perform processing using ultrasonic vibration in a preferable manner.
Type:
Application
Filed:
July 17, 2018
Publication date:
June 11, 2020
Applicants:
KIRA CORPORATION, UNIVERSITY OF MIYAZAKI, THE UNIVERISITY OF KITAKYUSHU