Abstract: Embodiments in accordance with the present invention relate to heat exchangers, and more specifically to graphitic foam (GF) heat exchanger assemblies developed for a plurality of thermal management applications including the management of heat from electronic components, primary engine cooling and energy recovery. According to certain embodiments, these assemblies are designed using a pressure normal to the GF exchange element to ensure thermal contact without the use of bonding materials or methods. The bondless assembly is designed to be resistant to high thermal stresses and large thermal expansion coefficient differences thereby achieving and maintaining the highest possible thermal performance.