Patents Assigned to THERMAL SOLUTION RESOURCES, LLC
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Patent number: 11112103Abstract: The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.Type: GrantFiled: November 8, 2018Date of Patent: September 7, 2021Assignees: Covestro LLC, Thermal Solution Resources, LLCInventors: Terry G. Davis, David Rocco, Mikhail Sagal, Jessee McCanna, Nicolas Sunderland, James Lorenzo, Mark Matsco, Kevin Dunay
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Patent number: 10156352Abstract: The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.Type: GrantFiled: April 16, 2014Date of Patent: December 18, 2018Assignees: COVESTRO LLC, THERMAL SOLUTION RESOURCES, LLCInventors: Terry G. Davis, David Rocco, Mikhail Sagal, Jessee McCanna, Nicolas Sunderland, James Lorenzo, Mark Matsco, Kevin Dunay
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Patent number: 9603226Abstract: An LED lighting device includes a light emitting assembly including at least one LED and a wireless network interface connecting the LED lighting device to a network. The wireless network interface includes a RF transceiver. An antenna is in electrical communication with the RF transceiver. A thermally conductive housing receives the light emitting assembly, the thermally conductive housing in thermal communication with the at least one LED. In one aspect the thermally conductive housing is formed of a thermally conductive and electrically nonconductive material. In another aspect, the thermally conductive housing includes a first portion attached to a second portion, wherein the first portion is formed of a first, thermally conductive material and defines an interior cavity receiving the wireless network interface. The second portion is formed of a second, electrically nonconductive material and defines an aperture allowing optical output of the at least one LED to pass therethrough.Type: GrantFiled: May 3, 2016Date of Patent: March 21, 2017Assignee: THERMAL SOLUTION RESOURCES, LLCInventors: E. Mikhail Sagal, Gary R. Arnold
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Patent number: 9491837Abstract: An LED lighting device includes a light emitting assembly including at least one LED and a wireless network interface connecting the LED lighting device to a network. The wireless network interface includes a RF transceiver. An antenna is in electrical communication with the RF transceiver. A thermally conductive housing receives the light emitting assembly, the thermally conductive housing in thermal communication with the at least one LED. In one aspect the thermally conductive housing is formed of a thermally conductive and electrically nonconductive material. In another aspect, the thermally conductive housing includes a first portion attached to a second portion, wherein the first portion is formed of a first, thermally conductive material and defines an interior cavity receiving the wireless network interface. The second portion is formed of a second, electrically nonconductive material and defines an aperture allowing optical output of the at least one LED to pass therethrough.Type: GrantFiled: May 3, 2016Date of Patent: November 8, 2016Assignee: THERMAL SOLUTION RESOURCES, LLCInventors: E. Mikhail Sagal, Gary R. Arnold
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Patent number: 9332621Abstract: An LED lighting device includes a light emitting assembly including at least one LED and a wireless network interface connecting the LED lighting device to a network. The wireless network interface includes a RF transceiver. An antenna is in electrical communication with the RF transceiver. A thermally conductive housing receives the light emitting assembly, the thermally conductive housing in thermal communication with the at least one LED. In one aspect the thermally conductive housing is formed of a thermally conductive and electrically nonconductive material. In another aspect, the thermally conductive housing includes a first portion attached to a second portion, wherein the first portion is formed of a first, thermally conductive material and defines an interior cavity receiving the wireless network interface. The second portion is formed of a second, electrically nonconductive material and defines an aperture allowing optical output of the at least one LED to pass therethrough.Type: GrantFiled: June 17, 2014Date of Patent: May 3, 2016Assignee: THERMAL SOLUTION RESOURCES, LLCInventors: E. Mikhail Sagal, Gary R. Arnold
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Patent number: 8827508Abstract: In one aspect, an LED lighting apparatus includes an electronic circuit board having a peripheral portion and a central portion that is radially inward of said peripheral portion, said electronic circuit board having an exterior side for optically interfacing with ambient environment during operation and an interior side opposite the exterior side. At least one LED is mounted on the exterior side of the electronic circuit board central portion and a thermally conductive housing encloses said electronic circuit board, said thermally conductive housing formed of a moldable thermally conductive material. The thermally conductive housing defines a first cavity adjacent the central portion of the electronic circuit board exterior side and a second cavity adjacent the central portion of the electronic circuit board interior side, wherein a portion of said thermally conductive housing being overmolded onto said peripheral portion. In a further aspect, a method of manufacturing an LED lighting apparatus is provided.Type: GrantFiled: October 22, 2010Date of Patent: September 9, 2014Assignee: Thermal Solution Resources, LLCInventor: E. Mikhail Sagal
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Publication number: 20120319031Abstract: The present invention provides a composition containing about 90% to about 30% of at least one amorphous thermoplastic or at least one semi crystalline thermoplastic or a mixture thereof and about 10% to about 70% of expanded graphite, wherein about 90% of the particles of the expanded graphite have a particle size of at least about 200 microns. The inventive compositions may find use in LED heat sink applications.Type: ApplicationFiled: June 15, 2011Publication date: December 20, 2012Applicants: Thermal Solution Resources, LLC, Bayer MaterialScience LLCInventors: Xiangyang Li, Mikhail Sagal
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Publication number: 20110095690Abstract: In one aspect, an LED lighting apparatus includes an electronic circuit board having a peripheral portion and a central portion that is radially inward of said peripheral portion, said electronic circuit board having an exterior side for optically interfacing with ambient environment during operation and an interior side opposite the exterior side. At least one LED is mounted on the exterior side of the electronic circuit board central portion and a thermally conductive housing encloses said electronic circuit board, said thermally conductive housing formed of a moldable thermally conductive material. The thermally conductive housing defines a first cavity adjacent the central portion of the electronic circuit board exterior side and a second cavity adjacent the central portion of the electronic circuit board interior side, wherein a portion of said thermally conductive housing being overmolded onto said peripheral portion. In a further aspect, a method of manufacturing an LED lighting apparatus is provided.Type: ApplicationFiled: October 22, 2010Publication date: April 28, 2011Applicant: THERMAL SOLUTION RESOURCES, LLCInventor: E. Mikhail Sagal