Abstract: A connector and compensating terminal apparatus for use with temperature responsive instruments is adapted to accommodate sensing devices such as thermocouples and RTDs having a wide plurality of lead connectors. The apparatus includes a temperature compensating block assembly having first and second conductive blocks coupled together at opposing surfaces by means of a thermally conductive and electrically insulative material, a corresponding surface of each block is adapted to receive one lead of a thermocouple sensor or RTD which lead is held in contact on the surface of the block by a holding block having a corrugated holding surface and which holding block is movably mounted with respect to the conductive block to provide a variable spacing to enable the apparatus to accommodate the different types of thermocouple or RTD lead connectors. Additionally, there are two outside conducting blocks for two of the 3 or 4 RTD leads which leads are also held in place by the respective holding blocks.

Abstract: A thermocouple temperature sensing device is disclosed for monitoring temperature at a plurality of selected locations along the length of an elongated conduit immersed within a heat conducting medium. The thermocouples, being progressive in length, are respectively attached to a common support rod by means of a thermal element. The thermal element is constructed to include an arcuate shaped strip of memory metal attached to the support rod and thermocouple by means of a C-shaped clip. As each thermal element reaches its transition temperature, its shape memory effect causes the thermal element to displace the thermocouple into forceable engagement with the inner wall of the conduit for monitoring the temperature thereat. As long as the thermal element is subjected to its transition temperature, there is a constant force being applied to the thermocouple.