Abstract: Disclosed is a resin composition, which comprises a thermosetting resin contained therein in an amount of 40 volume % or more, and a wax contained therein in an amount of 5 to 30 volume %, wherein: the thermosetting resin exists in liquid form at room temperature; and the wax exists in powder form at room temperature and has a melting point of 70 to 150° C., and wherein the resin composition has a viscosity of 50000 to 150000 mPa.s as measured at room temperature.

Abstract: [OBJECT] It is an object to provide a dielectric waveguide filter with attenuation poles, which is capable of suppressing deterioration in a high band-side attenuation characteristic with respect to a low band-side attenuation characteristic. [SOLUTION] A dielectric waveguide filter comprises a plurality of dielectric waveguide resonators each having a rectangular parallelepiped-shaped dielectric block, periphery of which is covered by a conductor film. The dielectric waveguide resonators are configured to form a main coupling path, and a sub coupling path bypassing a part of the main coupling path. The part of the main coupling path bypassed by the sub coupling path includes at least one capacitive coupling path.

Abstract: Dielectric waveguide comprising a circular input/output electrode on its bottom surface and surrounded by an exposed dielectric portion thereof around which a conductor film is disposed. A short stub crosses through the exposed dielectric portion to couple the electrode and film together. The printed circuit board has a front surface formed with a generally-circular island-shaped electrode surrounded by a front surface-side ground pattern in a spaced-apart relation thereto, and a back surface formed with a strip line surrounded by a back surface-side ground pattern in spaced-apart relation thereto. An approximate center of the island-shaped electrode and one end of the strip line are coupled together, and the front surface-side ground pattern and the back surface-side pattern are coupled together. The input/output electrode of the dielectric waveguide and the island-shaped electrode of the printed circuit board are coupled together.

Abstract: Disclosed is a noncontact electric power transmission system having a power transmitter circuit section 10 and a power receiver circuit section 30 which are adapted to be coupled to transmit electric power from a transmitter coil Lp provided in the power transmitter circuit section 10 to a receiver coil Ls provided in the power receiver circuit section 30, in a noncontact manner by means of electromagnetic induction.

Abstract: A dielectric waveguide slot antenna which is capable of radiating a circularly-polarized wave comprises: a dielectric waveguide having a slot through which a dielectric is exposed in a part of an electrically conductive film formed on a surface of the dielectric waveguide; a printed circuit board having a via hole opposed to the slot with the same shape as that of the slot; and a conductor plate having a first through-hole opposed to and having approximately the same shape as the via hole, and a pair of second through-holes in a vicinity of the first through-hole. The dielectric waveguide, the printed circuit board and the conductor plate are joined together with aligning the slot, the via hole and the first through-hole with each other. The printed circuit board has a conductor layer formed in positions facing to the second through-holes, and the second through-holes are arranged point-symmetrically with each other.

Abstract: Disclosed is a directional bar-type antenna which comprising a plurality of bar-shaped antenna elements including a core and a coil wound around the core. The first bar-shaped antenna element is disposed at a position of a mirror image of the second bar-shaped antenna element with respect to the core of the third bar-shaped antenna element. The first and second bar-shaped antenna elements is positioned such that one end of each of the first and second bar-shaped antenna elements is close to the third bar-shaped antenna element, and the other end is far from the third bar-shaped antenna element. In the present invention, a winding direction of the coil of the first bar-shaped antenna element is preferably identical to that of the coil of the second bar-shaped antenna element, and is opposite to that of the coil of the third bar-shaped antenna element.

Abstract: A high-density impurity diffused layer of an identical conduction type to the semiconductor substrate on which the impurity is doped higher in density than the semiconductor substrate around the diffuse resistance region is provided, one side of the electrodes is formed extending to the high-density impurity diffused layer and the diffused resistance region and the high-density impurity diffused layer are connected in a semiconductor strain gauge that is formed on the surface of the semiconductor substrate of a fixed conduction type and is provided with the diffused resistance region of opposite conduction type to the semiconductor substrate and is provided with electrodes on both ends of the diffused resistance region.

Abstract: The present invention provides a power transmission transformer of which workability in implementing and reliability of connection are considered in a noncontact power transfer device using individual self-oscillation circuits. The power transmission transformer for a noncontact power transfer device including a transmitting coil L1 and a drive coil L2 for self-oscillation on a power transmission device side includes a bobbin in which the transmitting coil and the drive coil L2 are disposed, in which the transmitting coil and the drive coil L2 are configured by an air-core coil using self-bonding wire, and the bobbin 1 includes a winder spindle 1a, 1b on both surfaces opposed to each other across a collar 2 formed of a flat plate, and a mating portion 3 for mating with an external portion in an end portion of the winder spindle 1b, and the drive coil L2 is mounted on the winder spindle 1b and the transmitting coil L1 is mounted on the other, opposed winder spindle 1a across the collar.

Abstract: The object is to provide a safe non-contact electric power transmission apparatus reducing unnecessarily consumed electric power, while intermittently-operated or otherwise restrained electric power transmission is not performed, and heat is not generated when a metal such as a foreign object is placed.

Abstract: A method of producing a surface-mount inductor by encapsulating a coil with an encapsulation material containing a resin and a filler using a mold die assembly is provided. In the method, a tablet and a coil are used. The tablet is prepared by preforming the encapsulation material into a shape having a flat plate-shaped portion and a pillar-shaped convex portion on a peripheral thereof. The coil is a wound conductive wire having a cross-section of rectangular-shape. The coil is placed on the tablet to allow both ends of the coil to extend along an outer side surface of the pillar-shaped convex portion of the tablet. The coil and the encapsulation material are integrated together while clamping the both ends of the coil between an inner wall surface of the mold die assembly and the outer side surface of the pillar-shaped convex portion of the tablet, to form a molded body.

Abstract: Disclosed is a noncontact electric power transmission system having a power transmitter circuit section 10 and a power receiver circuit section 30 which are adapted to be coupled to transmit electric power from a transmitter coil Lp provided in the power transmitter circuit section 10 to a receiver coil Ls provided in the power receiver circuit section 30, in a noncontact manner by means of electromagnetic induction.

Abstract: Disclosed is a resin composition, which comprises a thermosetting resin contained therein in an amount of 40 volume % or more, and a wax contained therein in an amount of 5 to 30 volume %, wherein: the thermosetting resin exists in liquid form at room temperature; and the wax exists in powder form at room temperature and has a melting point of 70 to 150° C., and wherein the resin composition has a viscosity of 50000 to 150000 mPa·s as measured at room temperature.

Abstract: In a dielectric waveguide-microstrip transition structure for mounting a dielectric waveguide on a printed-wiring board, one object of the present invention is directed to providing a further downsized structure as compared with a conventional structure, while maintaining an influence of displacement between the dielectric waveguide and the microstrip at a low level by means of non-contact coupling.

Abstract: Disclosed is a method of testing electrical characteristics of a semiconductor device having a ball-shaped external electrode. The method comprises preparing a plurality of cantilever-type contactors each supported by a support plate at a given position, and formed in such a manner that a tip thereof has a flat surface with an arc-shaped edge in an outer peripheral region thereof, and a cross-sectional diameter in a vicinity of the tip is greater than a radius of the ball-shaped external electrode, and pairing the cantilever-type contactors to provide paired two contactors.

Abstract: A miniature surface-mount electronic component which can ensure sufficient impact resistance and vibration resistance especially in an application to a severe use environment such as a vehicle-mounted coil, by putting some contrivance into a method for fixing a coil in a molding process and a method for holding a core and terminals. A miniature surface-mount electronic component including a bar-shaped core 2 on which a winding wire 3 is wound, and metal plates 5, with an outer casing 7 made of an insulating resin molded, includes flanges 2b substantially quadrangular in section at both ends of the bar-shaped core 2, and vertical grooves a and b are provided on side surfaces of the flanges 2b of the bar-shaped core 2 as fixing portions for preventing positional displacement occurring when the outer casing 7 is molded.

Abstract: A high-density impurity diffused layer of an identical conduction type to the semiconductor substrate on which the impurity is doped higher in density than the semiconductor substrate around the diffuse resistance region is provided, one side of the electrodes is formed extending to the high-density impurity diffused layer and the diffused resistance region and the high-density impurity diffused layer are connected in a semiconductor strain gauge that is formed on the surface of the semiconductor substrate of a fixed conduction type and is provided with the diffused resistance region of opposite conduction type to the semiconductor substrate and is provided with electrodes on both ends of the diffused resistance region.

Abstract: A high-density impurity diffused layer of an identical conduction type to the semiconductor substrate on which the impurity is doped higher in density than the semiconductor substrate around the diffuse resistance region is provided, one side of the electrodes is formed extending to the high-density impurity diffused layer and the diffused resistance region and the high-density impurity diffused layer are connected in a semiconductor strain gauge that is formed on the surface of the semiconductor substrate of a fixed conduction type and is provided with the diffused resistance region of opposite conduction type to the semiconductor substrate and is provided with electrodes on both ends of the diffused resistance region.

Abstract: There is provided a molded body having high fixing strength between a magnetic mold material and an external electrode. The molded body uses the magnetic mold material comprising at least 65 vol % of magnetic powder and up to 35 vol % of resin and the external electrode that has pits and projections on a surface that makes contact with the magnetic mold material. The external electrode and the magnetic mold material are integrally-molded such that at least a portion of the external electrode is exposed at at least one surface of the molded body. Spacing between the pit and projection of the external electrode is smaller than the maximum particle size of the magnetic powder.

Abstract: Disclosed is a method oft by using a plastic molding process, encapsulating an air-core coil with a moldable magnetic resin material prepared by kneading a mixture of a magnetic powder and a resin. The method comprises the steps of (a) preparing a molding die assembly which includes a plurality of dies adapted to define a cavity therewithin, and a positioning pin adapted to be movable in a vertical or horizontal direction within the cavity, (b) arranging the air-core coil at a given position within the cavity by the positioning pin, (c) charging the moldable magnetic resin material into the cavity and moving the positioning pin to a given retracted position in a course of the charging.

Abstract: Disclosed is a directional bar-type antenna which comprising a plurality of bar-shaped antenna elements including a core and a coil wound around the core. The first bar-shaped antenna element is disposed at a position of a mirror image of the second bar-shaped antenna element with respect to the core of the third bar-shaped antenna element. The first and second bar-shaped antenna elements is positioned such that one end of each of the first and second bar-shaped antenna elements is close to the third bar-shaped antenna element, and the other end is far from the third bar-shaped antenna element. In the present invention, a winding direction of the coil of the first bar-shaped antenna element is preferably identical to that of the coil of the second bar-shaped antenna element, and is opposite to that of the coil of the third bar-shaped antenna element.