Abstract: A synthetic grindstone for performing surface processing, includes: abrasive grains; binder made of a thermosetting resin material and holding the abrasive grains in a dispersed state; and filler including at least one of first filler, second filler, and third filler. The first filler has a larger average particle diameter than the abrasive grains. The second filler has electrical conductivity. The third filler is harder than a workpiece. The filler is disposed in a state of being dispersed in the binder.

Abstract: A synthetic grindstone for performing surface processing, includes: abrasive grains; binder made of a thermosetting resin material and holding the abrasive grains in a dispersed state; and filler including at least one of first filler, second filler, and third filler. The first filler has a larger average particle diameter than the abrasive grains. The second filler has electrical conductivity. The third filler is harder than a workpiece. The filler is disposed in a state of being dispersed in the binder.

Abstract: A synthetic grindstone for performing surface processing includes: abrasive grains; a vitrified-material binder configured to retain the abrasive grains in a dispersed state; and a filler arranged in the binder in a dispersed state. The filler includes at least one of a first filler having an average grain size larger than an abrasive grain size of the abrasive grains, a second filler having an electrical conductivity, or a third filler having a hardness higher than a hardness of an object to be ground.

Abstract: A synthetic grindstone for performing a surface processing includes abrasive grains with an abrasive grain proportion (Vg) higher than 0 vol. % and equal to or lower than 40 vol. %, includes a nonwoven-fabric binder with a binder proportion (Vb) equal to or higher than 35 vol. % and lower than 90 vol. %. The synthetic grindstone has a porosity (Vp) higher than 10 vol. % and equal to or lower than 55 vol. %.

Abstract: According to an embodiment, an electrodeposition whetstone includes a plating layer, first abrasive grains protruding from the plating layer, and second abrasive grains which are arranged between the first abrasive grains. The amount of protrusion of the second abrasive grains from the plating layer is smaller than the amount of protrusion of the first abrasive grains from the plating layer. A grain size of the second abrasive grains is smaller than a grain size of the first abrasive grains.

Abstract: A synthetic grindstone (100) for chemo-mechanical grinding a wafer S, comprising: an abrasive (101) that contains cerium oxide having an average particle diameter of 10 ?m or less as a main component and has a chemo-mechanical grinding action on the wafer S; a friction promoter (102) that contains a fiber material having a Mohs hardness lower than that of the wafer S and a high friction coefficient as a main component and promotes heat generation; and a binder (103) that contains a phenol resin as a main component and disperses and binds the abrasive (101) and the friction promotor (102).

Abstract: A synthetic grindstone (100) for chemo-mechanical grinding a wafer W, comprising: an abrasive grain (101) having a chemo-mechanical grinding action on the wafer W and having a particle diameter of less than 5 ?m; a spherical filler (102) formed of a material as hard as or softer than the wafer W and having a particle diameter larger than that of the abrasive grain (101); and a resin binder (103) that integrally binds the abrasive grain (101) and the spherical filler (102).

Abstract: A synthetic grinding stone used for the polishing of a silicon wafer is composed of a structure containing cerium oxide fine particles as abrasive grains, a resin as a binder, a salt as a filler and a nano diamond as an additive. This synthetic grinding stone is characterized in that the purity of the cerium oxide is not less than 60% by weight, the content of the salt as a filler is not less than 1% but not more than 20%, the volume content of the nano diamond as an additive is not less than 0.1% but less than 20% relative to the total volume of the structure, and the porosity as the volume fraction relative to the total volume of the structure is less than 30%.

Abstract: A grinding tool of the present invention is configured by having grinding surface that comes into direct contact with the surface of the object to be ground. Multiple small protuberances which include diamonds and other abrasive materials are formed on the grinding surface. Surface area of the small protuberances and the distance between the small protuberances are set such that the grinding resistance was maintained at an approximate constant value after a substantially constant grinding resistance value was reached.