Patents Assigned to Tokyo Dipp Co., Ltd.
  • Patent number: 5474471
    Abstract: An electrical connector having a sleeve for insulating a solderless terminal having a rear end which covers an electrical lead extending substantially perpendicular to the terminal and a solderless connection between the lead end and the terminal. The sleeve comprises a body with a first and a second sidewall, a leaf hingedly connected to the first sidewall at the rear end of the sleeve and at least one resilient hook means arranged at an end of the leaf opposite to the hinged connection. The hook means has a projection at a free end to engage a hole in the second sidewall to insure that the leaf covers the rear end of the sleeve and the projection engages the hole in the second sidewall.
    Type: Grant
    Filed: January 31, 1995
    Date of Patent: December 12, 1995
    Assignee: Tokyo Dipp Co., Ltd.
    Inventor: Shinzo Tanaka
  • Patent number: 5444185
    Abstract: An insulating sleeve of elastic plastic for encasing an electric terminal having a front part having a hole to accommodate the plug end of the terminal, the width of the hole being larger than the height thereof, and a rear part having a hole whose height is large enough to accommodate the widest part of the terminal and whose width is large enough to pass the height of the terminal but not large enough to pass the widest part of the terminal, and an intermediate part having a hole whose diameter is large enough to permit the terminal to be rotated about the longitudinal axis thereof. The terminal that can be inserted and extracted through the rear part of the sleeve remains firmly locked in the sleeve during service.
    Type: Grant
    Filed: September 15, 1993
    Date of Patent: August 22, 1995
    Assignee: Tokyo Dipp Co., Ltd.
    Inventor: Shinzo Tanaka