Patents Assigned to Tokyou Electron Limited
  • Publication number: 20050163598
    Abstract: The present invention relates to a method of conveying a substrate that can convey even a thinned substrate while maintaining its flatness and prevents particles from adhering to the substrate, wherein the step of a conveyor attaching a third substrate holding mechanism to the substrate with a first substrate holding mechanism holding the substrate, the step of driving the third substrate holding mechanism so as to hold the substrate by the conveyor while a first base is holding the substrate, and thereafter canceling the holding of the substrate by the first substrate holding mechanism and jetting out fluid from a first fluid jetting mechanism, the step of conveying the substrate from the first base to a second base and attaching the substrate to a second substrate holding mechanism, and the step of driving the second substrate holding mechanism so as to hold the substrate by the second base while the third base is holding the substrate, and thereafter jetting out fluid from a second fluid jetting mechanism
    Type: Application
    Filed: December 26, 2002
    Publication date: July 28, 2005
    Applicant: Tokyou Electron Limited
    Inventors: Mitsuhiro Yuasa, Koji Homma