Patents Assigned to Tokyou Seimitsu Co., Ltd.
  • Ingot support device in slicing apparatus
    Patent number: 4949700
    Abstract: A slicing apparatus is disclosed which slices a cylindrical ingot into disc-shaped wafers by a rotating blade. The slicing apparatus includes an ingot support device which is used to contact support the ingot at a position opposed to the position of the ingot to be sliced by the blade. Therefore, a rection force which is produced in the ingot slicing can be supported by the ingot support device, thereby eliminating any ill effects on the hold surface of the ingot.
    Type: Grant
    Filed: December 8, 1988
    Date of Patent: August 21, 1990
    Assignee: Tokyou Seimitsu Co., Ltd.
    Inventor: Masao Ebashi