Abstract: Disclosed in a halogen-free flame-retardant epoxy resin composition, comprising (A) a bisphenol A type epoxy resin, (B) a novolak type epoxy resin, (C) a phenolic resin type curing agent, (D) a curing accelerator, and (E) an inorganic filler. The phenolic resin type curing agent (C) is provided by a nitrogen-containing phenolic resin, preferably, by a co-condensation resin formed by the reaction among a phenolic compound, a guanamine compound, and an aldehyde compound. More desirably, a phenolic resin containing both phosphorus and nitrogen should be used as the curing agent (C). Further, a combination of the co-condensation resin noted above (C-1) and a reactive phosphoric acid ester can be used as a curing agent.

Abstract: A termite sensor and intrusion detection system for detecting the intrusion of termites into wooden buildings. Conductive particles fill a container which termites can eat. A pair of electrodes are disposed opposite each other inside the container. A pair of terminals are connected to the electrodes and extend outside the container. Termites are detected by a change of conductivity between the electrodes, when termites are detected a warning device generates a warning signal.

Abstract: A halogen-free flame retardant epoxy resin composition containing (A) a bisphenol A type epoxy resin, (B) a curing agent, (C) red phosphorus particles each of which is covered with a covering layer, at least the outermost layer of which is formed of a resin, and (D) an inorganic filler.

Abstract: Disclosed in a halogen-free flame-retardant epoxy resin composition, comprising (A) a bisphenol A type epoxy resin, (B) a novolak type epoxy resin, (C) a phenolic resin type curing agent, (D) a curing accelerator, and (E) an inorganic filler. The phenolic resin type curing agent (C) is provided by a nitrogen-containing phenolic resin, preferably, by a co-condensation resin formed by the reaction among a phenolic compound, a guanamine compound, and an aldehyde compound. More desirably, a phenolic resin containing both phosphorus and nitrogen should be used as the curing agent (C). Further, a combination of the co-condensation resin noted above (C-1) and a reactive phosphoric acid ester can be used as a curing agent.

Abstract: A multiple-pin terminal adapter comprising a substrate and a multiplicity of electrical contact pins extending from above and below the substrate for connection with printed circuit boards. A first group of contact pins extend downwardly for connection with the underlying printed circuit board, while a second group of contact pins extend upwardly out of axial alignment with the first group to assume a generally meander or otherwise random formation whereby adjacent contact pins in the second group are spaced a sufficient distance apart from one another to facilitate access for solder connection. A relay socket means is also provided for use in combination with the terminal adapter to provide easy access for connection to printed circuit boards packed with high density electrical components.

Abstract: A rubber-modified phenolic resin composition contains a novolak-type phenolic resin in which at least one modifying agent selected from the group consisting of an ABS resin and an MBS resin is homogeneously dispersed. The composition has good impact resistance and thermal shock resistance. The composition is prepared by adding at least one modifying agent described above to a novolak-type phenolic resin which is heated and melted at its softening point or more, so that the modifying agent is homogeneous dispersed in the resin. The resin composition is suitably used as a curing agent for an epoxy resin encapsulant for sealing electronic devices.

Abstract: A polymeric acid is synthesized by the ring-opening poly-addition reaction using a biphenyl tetracarboxylic acid as a tetracarboxylic acid moiety and an aromatic diamine, particularly p-phenylene diamine, as a diamine moiety. An aromatic polyimide resin layer possessing a highly desirable heat-resisting property as a heat-resistant insulating coating material and excelling in adhesive strength relative to a substrate is obtained by adjusting the polymeric acid in viscosity with a suitable organic solvent, applying the resultant polyamic acid on a substrate, and firing the applied layer of the polyamic acid. The substrate, for example, is a conductor layer formed as with copper and used as a multi-layer wiring board for hybrid IC's.

Abstract: A rubber-modified phenolic resin composition contains a novolak-type phenolic resin in which at least one modifying agent selected from the group consisting of an ABS resin and an MBS resin is homogeneously dispersed. The composition has good impact resistance and thermal shock resistance. The composition is prepared by adding at least one modifying agent described above to a novolak-type phenolic resin which is heated and melted at its softening point or more, so that the modifying agent is homogeneous dispersed in the resin. The resin composition is suitably used as a curing agent for an epoxy resin encapsulant for sealing electronic devices.

Abstract: There is provided an electric conductive resin composition formed into a pellet, which includes an electric conductive filler comprising electric conductive fibers and a low-melting point metal, and being coated on the surface thereof with a thermoplastic resin. Flux and/or a phosphorus-based antioxidant may be added to the filler. There is also provided an electromagnetic wave shielding molded product prepared by using the electric conductive resin composition mentioned above, wherein the electric conductive fibers dispersed within the molded product are fixed each other through the low-melting point metal.

Abstract: A polyamic acid is synthesized by the ring-opening poly-addition reaction using a biphenyl tetracarboxylic acid as a tetracarboxylic acid moiety and an aromatic diamine, particularly p-phenylene diamine, as a diamine moiety. An aromatic polyimide resin layer possessing a highly desirable heat-resisting property as a heat-resistant insulating coating material and excelling in adhesive strength relative to a substrate is obtained by adjusting the polyamic acid in viscosity with a suitable organic solvent, applying the resultant polyamic acid on a substrate, and firing the applied layer of the polyamic acid. The substrate, for example, is a conductor layer formed as with copper and used as a multi-layer wiring board for hybrid IC's.