Abstract: The present invention provides a plastic container with excellent slipping property for contents. According to the present invention, provided is a plastic container for storing contents, wherein the plastic container is a blow molded body, an innermost layer in contact with the contents is formed of a resin composition containing a base resin and filler particles, and an inner surface of the innermost layer is provided with concave and convex shapes due to presence of the filler particles.

Abstract: The present invention provides a packaging material that allows for lesser adsorption of a medicinal component on the material, that can be processed into a packaging pouch without using an adhesive, and that has excellent tearability. Specifically, the present invention provides a packaging material including, on or above one or both surfaces of a substrate, a primer layer and a low-adsorption coating layer with a grammage of 0.5 to 20 g/m2 in this order, wherein the primer layer contains an acid-modified product of a block copolymer that contains a block A containing a structural unit derived from an aromatic vinyl compound, and a block B containing a structural unit derived from a conjugated diene compound and/or an acid-modified product of a hydrogenated product of the block copolymer; and the low-adsorption coating layer contains a cyclic polyolefin.

Abstract: A main object of the present invention to provide a coated pigment that is composed of a composite particle comprising a silicon compound coated on the surface of a metal particle, and that can be dispersed with relatively few aggregates. The present invention relates to a coated pigment comprising a composite particle containing a metal particle and one or two or more coating layers on the surface of the metal particle, wherein (1) at least one of the coating layers is a silicon compound-containing layer, and (2) the proportion of aggregates formed by adhesion of at least four of the composite particles with each other is not more than 35% by number.

Abstract: An aluminum flake pigment is an aluminum flake pigment including aluminum flakes, wherein the aluminum flakes include small-size aluminum flakes each having a particle size of less than or equal to 1 ?m, and in a microscope image when the aluminum flakes are observed using a scanning electron microscope, a ratio of the number of the small-size aluminum flakes is less than or equal to 35% with respect to the number of a whole of the aluminum flakes.

Abstract: [Problem] To provide: a film which is for aging meat and which is relatively easy to treat and allows meat to be aged more safely and effectively; and a film which is for preserving meat and can effectively suppress the deterioration of color or the like of fresh meat. [Solution] The present invention relates to a film for preserving meat, the film being characterized by: (1) including a hydrogen generating layer containing hydrogen generating particles which can generate a molecular hydrogen upon reacting with water; and (2) using the film in a state in which the hydrogen generating layer is directly contacted with the surface of the meat.

Abstract: Provided is an aluminum alloy foil that has sufficient surface hardness, while exhibiting excellent moist-heat resistance and corrosion resistance. The aluminum alloy foil contains 96.9 mass % or more aluminum, 0.4 mass % or more and 3 mass % or less of manganese, 0.03 mass % or more and 0.08 mass % or less of iron, 0.00001 mass % or more and 0.1 mass % or less of silicon, 0.00001 mass % or more and 0.03 mass % or less of copper, 0.00001 mass % or more and 0.01 mass % or less of zinc, and 0.00001 mass % or more and 0.001 mass % or less of magnesium, based on the aluminum alloy foil taken as 100 mass %.

Abstract: This invention provides a paste composition that enables a silicon germanium layer to be formed safely and easily, and a method for forming a silicon germanium layer safely and easily. The present invention provides a paste composition for forming a silicon germanium layer, the composition comprising aluminum and germanium, wherein the content of the germanium is more than 1 part by mass and 10000 parts by mass or less, per 100 parts by mass of the aluminum.

Abstract: A fixing member for medical treatment is provided which is constituted by filaments containing a thermoplastic resin and a filler. The filaments are entangled together to form a mesh structure.

Abstract: A solar cell module is disclosed including, in sequence from a light-receiving surface side, a surface glass layer having thickness of 0.8 mm or more and 1.6 mm or less, a first sealing layer, cells, a second sealing layer, and a back protective layer, (1) the back protective layer includes, in sequence from a side closer to the second sealing layer, a first thermoplastic resin layer in foam state and having flexural modulus of 200 MPa or more and 1000 MPa or less, and a second thermoplastic resin layer containing glass fiber and having flexural modulus of 10000 MPa or more and 25000 MPa or less; and (2) the sum of flexural rigidity of each of the surface glass layer, the first sealing layer, the second sealing layer, and the back protective layer is 4000 MPa or more, the flexural rigidity being defined by: {(flexural modulus (MPa)×thickness (mm)3)/12}.

Abstract: A method is disclosed for installing a solar cell module, which enables easy installation of a solar cell module on a rack, and also enables a worker to install a solar cell module without climbing on the roof. A solar cell module is installed on a rack mounted on a roof. The solar cell module includes a frame formed of a material containing a resin. The rack includes multiple rails each having a groove, and the grooves of a pair of the rails are disposed to be opposed to each other. The method of this invention comprises the steps of fitting the frame of the solar cell module into the groove such that the solar cell module is retained by the pair of the rails, and fixing the solar cell module to the pair of the rails to prevent the solar cell module from falling out of the grooves.

Abstract: An aluminum foil having a high adhesiveness to solder and containing at least one of Sn and Bi, in which a ratio of a total mass of Sn and Bi to a total mass of the aluminum foil is 0.0075 mass % or more and 15 mass % or less.

Abstract: An aluminum particle group composed of aluminum particles, as observed in an image thereof obtained through a scanning electron microscope, has an average circularity of 0.75 or more, and an average particle diameter of D50 of 10 ?m or more and less than 100 ?m, and satisfies A×3?B and also satisfying D<C where A represents the number of aluminum particles having a diameter of less than 5 ?m, B represents the number of aluminum particles having a diameter of 10 ?m or more, C represents the number of aluminum particles with no satellite, and D represents the number of aluminum particles having satellites.

Abstract: Provided is an aluminum alloy foil that has sufficient surface hardness, while exhibiting excellent moist-heat resistance and corrosion resistance. The aluminum alloy foil contains 96.9 mass % or more of aluminum, 0.4 mass % or more and 3 mass % or less of manganese, 0.03 mass % or more and 0.08 mass % or less of iron, 0.00001 mass % or more and 0.1 mass % or less of silicon, 0.00001 mass % or more and 0.03 mass % or less of copper, 0.00001 mass % or more and 0.01 mass % or less of zinc, and 0.00001 mass % or more and 0.001 mass % or less of magnesium, based on the aluminum alloy foil taken as 100 mass %.

Abstract: An aluminum alloy additive manufacturing product and a method manufactures the same. The aluminum alloy additive manufacturing product is formed by molding a raw metal by an additive manufacturing method. The raw metal is made of an aluminum alloy. The aluminum alloy contains Fe and one or more of Mn and Cr. The Fe is an inevitable impurity of 0.3 weight % or less. The one or more of Mn and Cr have a total weight of 0.3 to 10 weight %. The aluminum alloy additive manufacturing product contains any one or more of an intermetallic compound and an aluminum alloy solid solution. The intermetallic compound contains two or more of Al, Mn, Fe, and Cr. One or more elements of Mn, Fe, and Cr are dissolved in the aluminum alloy solid solution.

Abstract: Provided is a coating film that can more reliably exhibit an excellent water repellency and an excellent oil repellency. This water- and oil-repellent coating film is a coating film formed on a surface of a material in order to impart water repellency and oil repellency, wherein (1) the coating film contains a metal oxide-containing composite particle; (2) the composite particle contains a) a metal oxide particle and b) a covering layer that contains a polyfluoroalkyl methacrylate resin and is formed on the surface of the metal oxide particle; and (3) a value obtained by dividing the fluorine content (weight %) of the composite particle by a surface area (m2/g) of the metal oxide particle is 0.025 to 0.180.

Abstract: Provided is a paste composition that enables the formation of a diffusion layer with a high concentration of n-type dopant element on a semiconductor substrate in a simple manner. The paste composition is intended to form a film on a semiconductor substrate. The paste composition contains an aluminum powder, a compound containing an n-type dopant element, a resin, and a solvent. The n-type dopant element is one, two, or more elements selected from the group consisting of phosphorus, antimony, arsenic, and bismuth. The content of the n-type dopant element in the n-type dopant element-containing compound is 1.5 parts by mass or more and 1000 parts by mass or less, per 100 parts by mass of aluminum contained in the aluminum powder.

Abstract: An object of the present invention is to provide a flaky metal pigment that is reduced in particle size. According to the flaky metal pigment of the present invention, in the case where the flaky metal pigment is measured by a flow-type particle image analyzer, P50 showing a 50% cumulative frequency of a diameter equivalent to an area circle in a number distribution is less than 0.500 ?m.

Abstract: A ratio of a total surface area of aluminum particles pressed into or adhering to a region having a predetermined surface area to the surface area of the region is less than or equal to 0.05%. The total surface area of crystallized products present in the region is less than or equal to 2% with respect to the surface area of the region. An average surface area per crystallized product is less than or equal to 2 ?m2. Surface roughness Ra of the region is less than 20 nm.

Abstract: A composite conductive particle according to the present invention includes a first conductive particle having a particle diameter of greater than or equal to 0.1 ?m and less than or equal to 50 ?m; and a second conductive particle adhering to the surface of the first conductive particle and having a particle diameter of greater than or equal to 50 nm and less than or equal to 1000 nm, and the first conductive particle is composed of a first particle and a first metal coating covering the surface of the first particle, the second conductive particle is composed of a second particle and a second metal coating covering the surface of the second particle, a particle diameter of the first conductive particle is larger than a particle diameter of the second conductive particle, and an adhering rate of the second conductive particle.

Abstract: The present invention relates to a method for manufacturing a circuit board including the steps of preparing a substrate containing silicon at least at a surface, applying a paste containing aluminum particles onto the substrate, forming a conductor layer on the substrate by firing the substrate to which the paste has been applied, forming a resist film having a specific pattern on the conductor layer, and removing with an etchant, the conductor layer in a portion where the resist film has not been formed, the etchant containing fluoride ions and metal ions of a metal M of which standard electrode potential is higher in value than a standard electrode potential of aluminum, and to a circuit board which can be manufactured with such a method.