Patents Assigned to TREICHEL
  • Publication number: 20020061718
    Abstract: A method and system are provided for reducing and eliminating photo-assisted copper corrosion during a wafer cleaning process. In one example, a method is provided for making a composite material for the cover of a wafer cleaning system. A first transparent layer is formed. A transparency tunable layer is formed over the first transparent layer. Electrical connections are defined between a first portion and a second portion of the transparency tunable layer. And a second transparent layer is formed over the transparency tunable layer.
    Type: Application
    Filed: September 29, 1999
    Publication date: May 23, 2002
    Applicant: TREICHEL
    Inventors: HELMUTH W. TREICHEL, JULIA S. SVIRCHEVSKI, MIKE RAVKIN