Abstract: Disclosed is a conductor pattern structure of a capacitive touch panel. First-axis conductor assemblies and second-axis conductor assemblies are formed on a surface of a substrate. Each first-axis conductor assembly includes a plurality of first-axis conductor cells that are interconnected by first-axis conduction lines. An insulation layer is formed on a surface of each first-axis conduction line. Each second-axis conductor assembly includes a plurality of second-axis conductor cells that are interconnected by second-axis conduction lines. Each second-axis conduction line extends across the insulation layer of the associated first-axis conduction line.

Abstract: A method of hiding transparent electrodes on a transparent substrate coats a solution of non-conductive nanoparticles onto the transparent substrate and the transparent electrodes after forming a plurality of transparent electrodes on the transparent substrate, and both non-conductive nanoparticles and transparent electrodes have the same reflective index of light. After a high-temperature thermal processing is performed to the transparent substrate, an even mask is formed on the transparent substrate and the transparent electrodes, such that the non-conductive nanoparticles in the mask provide the same reflective index of light for the positions of the transparent substrate with and without the transparent electrodes, so as to effectively prevent a different reflective index of light at any position of the transparent substrate that will cause a poor image quality of the screen.

Abstract: The present invention is to provide a display panel comprising an upper polarizer; a lower polarizer; a lower glass substrate provided on the lower polarizer; an upper glass substrate provided below the upper polarizer; an upper transparent ITO layer provided under the upper glass substrate; a lower transparent ITO layer provided on the lower glass substrate; an intermediate liquid crystal layer sandwiched by the transparent ITO layers; and a touching circuit layer sandwiched by the upper polarizer and the upper glass substrate and disposed above the liquid crystal layer, enabling the touching circuit to be directly mounted in the display panel rather than assembling together after manufacturing.

Abstract: The present invention is to provide a wiring of a touch panel comprising a glass substrate including a transparent and conductive layer on a top surface; a plurality of wires disposed along a border of the glass substrate; a plurality of conductive ends formed at the top side of the glass substrate, each of the wires being electrically connected to one of the conductive ends; and a flexible circuit board provided at the wires, the flexible circuit board including a plurality of connections each electrically connected to one of the conductive ends. By utilizing this wiring, prior used conductors are replaced by the flexible circuit board in order to decrease wiring area and make wiring of the touch panel become narrower.

Abstract: The present invention is to provide a touch screen having a bacteria inhibition layer for prohibiting bacteria from growing thereon and a method for manufacturing the same comprising uniformly dispersing particles of nano metal material in a solution to be applied to a surface treatment so that the solution can have a concentration of 20 ppm to 500 ppm; evenly spray coating the solution on a screen of the touch screen; and subjecting the solution coated on the screen of the touch screen to a heat treatment until solvent in the solution is completely evaporated so that the particles of the nano metal material are densely adhered to the screen of the touch screen to form a bacteria inhibition layer thereon.

Abstract: The present invention is to provide a method of manufacturing a circuit layout on a touch panel by utilizing metal plating technology, comprising uniformly coating a conductive metal or conductive oxidized metal on predetermined areas proximate edges of a transparent conductive layer on a transparent glass substrate for forming a circuit by utilizing metal plating technology, which has the advantages of uniform thickness of circuit, higher hardness, better adhesion of the plated material to the underlying substrate, whether it is a resistive film or bare glass, improved weathering and chemical properties, and solderability.