Patents Assigned to UMS Co., Ltd.
  • Publication number: 20130174868
    Abstract: Provided are a purification method and purification apparatus for an alkaline treatment liquid for a semiconductor substrate, which use adsorption purification means that can purify various alkaline treatment liquids to be used for treating semiconductor substrates for various purposes so as to have an ultrahigh purity, in particular, an Fe concentration in a ppq region, and that is excellent in chemical resistance and mechanical strength. The adsorption purification means is purification means for an alkaline treatment liquid for treating a semiconductor substrate for various purposes at the time of producing, for example, a semiconductor substrate or a semiconductor device.
    Type: Application
    Filed: September 26, 2011
    Publication date: July 11, 2013
    Applicants: UMS CO., LTD., TAMA CHEMICALS CO., LTD.
    Inventors: Hisashi Muraoka, Toshitsura Cho
  • Publication number: 20090068898
    Abstract: Provided is a connector for a movable storage device which can prevent escape of the movable storage device.
    Type: Application
    Filed: February 28, 2007
    Publication date: March 12, 2009
    Applicant: SKY UMS CO., LTD.
    Inventor: Wang Soo Ryu
  • Patent number: 6851873
    Abstract: A method and an apparatus for removing an organic film, such as a resist film, from a substrate surface are provided wherein a treatment liquid containing dissolved ozone, and preferably formed from liquid ethylene or propylene carbonate, or both, is contacted with the substrate having the organic film, and the organic film removed, wherein the apparatus contains (A) a treatment liquid delivery device, (B) a film contact device, (C) a liquid circulation device and (D) an ozone dissolution device.
    Type: Grant
    Filed: October 14, 2003
    Date of Patent: February 8, 2005
    Assignees: Nomura Micro Science Co., Ltd., UMS Co., Ltd.
    Inventors: Hisashi Muraoka, Rieko Muraoka, Asuka Sato, Mitsuru Endo
  • Patent number: 6696228
    Abstract: A method and an apparatus for removing an organic film such as a resist film from a substrate surface are provided. These are very safe even at high temperatures, and use a treatment liquid which can be recycled and reused. A treatment liquid typically formed from liquid ethylene carbonate, propylene carbonate, or a liquid mixture of these two compounds, and in particular such a treatment liquid containing dissolved ozone, is contacted with a substrate with an organic film, and the organic film is removed.
    Type: Grant
    Filed: October 21, 2002
    Date of Patent: February 24, 2004
    Assignees: UMS Co., Ltd., Nomura Micro Science Co., Ltd.
    Inventors: Hisashi Muraoka, Rieko Muraoka, Asuka Sato, Mitsuru Endo
  • Publication number: 20030108823
    Abstract: A method and an apparatus for removing an organic film such as a resist film from a substrate surface are provided. These are very safe even at high temperatures, and use a treatment liquid which can be recycled and reused. A treatment liquid typically formed from liquid ethylene carbonate, propylene carbonate, or a liquid mixture of these two compounds, and in particular such a treatment liquid containing dissolved ozone, is contacted with a substrate with an organic film, and the organic film is removed.
    Type: Application
    Filed: October 21, 2002
    Publication date: June 12, 2003
    Applicants: UMS Co., Ltd., Purex Co., Ltd.
    Inventors: Hisashi Muraoka, Rieko Muraoka, Asuka Sato, Mitsuru Endo