Abstract: An infrared sensor array with interconnection type, comprises a substrate, a plurality of circuit units, and a plurality of infrared sensing modules. The substrate defines several sensing segments. Each sensing segment has a base portion, a connecting portion, and a testing portion. The connecting portion is arranged between the base portion and the testing portion. The circuit units are respectively formed on the sensing segments. Each circuit unit has a base circuit, a connecting circuit, and a testing circuit. The connecting circuit electrically connects to the base circuit and the testing circuit. Each base circuit is formed on each base portion, each connecting circuit is formed on each connecting portion, and each testing circuit is formed on each testing portion. The infrared sensing modules are respectively disposed on the base portions and electrically connected to the base circuits.

Abstract: An infrared sensor array with interconnection type, comprises a substrate, a plurality of circuit units, and a plurality of infrared sensing modules. The substrate defines several sensing segments. Each sensing segment has a base portion, a connecting portion, and a testing portion. The connecting portion is arranged between the base portion and the testing portion. The circuit units are respectively formed on the sensing segments. Each circuit unit has a base circuit, a connecting circuit, and a testing circuit. The connecting circuit electrically connects to the base circuit and the testing circuit. Each base circuit is formed on each base portion, each connecting circuit is formed on each connecting portion, and each testing circuit is formed on each testing portion. The infrared sensing modules are respectively disposed on the base portions and electrically connected to the base circuits.

Abstract: A manufacturing method for an infrared sensor includes the following steps: providing a wafer having several chips and a substrate; forming four soldering portions, a thermistor, and an infrared sensing layer on the bottom surface of each chip, wherein the soldering portions are connected electrically to the thermistor and the infrared sensing layer; disposing a soldering material onto at least one bonding location for each soldering portion; backside-etching each chip of the wafer to form a sensing film and a surrounding wall around the sensing film; bonding the wafer and the substrate; heating the soldering materials to connect the substrate and each chip of the wafer; disposing an infrared filter on the surrounding wall of each chip; cutting the wafer and the substrate to form a plurality of individual infrared sensors. The instant disclosure further provides an associated infrared sensor.

Abstract: A manufacturing method for an infrared sensor includes the following steps: providing a wafer having several chips and a substrate; forming four soldering portions, a thermistor, and an infrared sensing layer on the bottom surface of each chip, wherein the soldering portions are connected electrically to the thermistor and the infrared sensing layer; disposing a soldering material onto at least one bonding location for each soldering portion; backside-etching each chip of the wafer to form a sensing film and a surrounding wall around the sensing film; bonding the wafer and the substrate; heating the soldering materials to connect the substrate and each chip of the wafer; disposing an infrared filter on the surrounding wall of each chip; cutting the wafer and the substrate to form a plurality of individual infrared sensors. The instant disclosure further provides an associated infrared sensor.

Abstract: The present invention provides a packaging structure of a gas detector and the method for making the same. The packaging structure of the gas detector includes a printed circuit board, a detection device and a ventilation cover. The detection device is attached to the printed circuit board by adhesive, and metallic wires are formed on the printed circuit board by wire-bonding process. The ventilation cover is positioned at the printed circuit board to cover the detection device. Signal terminals of the detection device are electrically connected with the contact terminals of the printed circuit board so as to test and check signals of the detection device. In this regard, the present invention is used to test and package a plurality of detection devices using one printed circuit board and without metallic terminals so that cost of the gas detector is significantly reduced.

Abstract: A dual-band reflective infrared thermal imaging system is described. The dual-band reflective infrared thermal imaging system includes a reflective infrared thermal imager and a refractive visible light video camera. The refractive visible light video camera is configured at the central axis of the reflective infrared thermal imager so that the refractive visible light video camera and the reflective infrared thermal imager can synchronously and coaxially capture the images. The reflective infrared thermal imager further includes a reflective optical module and an infrared imaging sensor. The infrared images are focused on the infrared imaging sensor by way of the reflective optical module.

Abstract: A method to enhance the connection strength of suspended membrane leads and substrate contacts is described. A reading circuit chip is provided and a sacrificial layer is formed thereon. Subsequently, an electrical contact window is created in the sacrificial layer to expose a conductive layer of the reading circuit chip. A metal layer is filled into the contact window and a conductive membrane is formed thereon to couple electrically to the metal layer. Afterward, an infrared measuring membrane and an upper dielectric layer are formed thereon.

Abstract: A multi-function detecting pen is described. The multi-function detecting pen includes a head module, a detecting chips module, a power module, a lighting module, and a control module. The head module is disposed at a front portion of the pen and the detecting chips module is followed. The detecting chips module may include at least one pressure detecting chip for measuring a pressure, e.g. tire pressure, and/or a gas detecting chip for measuring a gas concentration, e.g. alcohol concentration. The detecting chips module may further include a temperature detecting chip for measuring a temperature, e.g. ambient temperature or tympanum temperature. The head module may further include a switchable or a replaceable adapter for coupling to the corresponding object and keeping the head module clean.

Abstract: A method to enhance the connection strength of suspended membrane leads and substrate contacts is described. A reading circuit chip is provided and a sacrificial layer is formed thereon. Subsequently, an electrical contact window is created in the sacrificial layer to expose a conductive layer of the reading circuit chip. A metal layer is filled into the contact window and a conductive membrane is formed thereon to couple electrically to the metal layer. Afterward, an infrared measuring membrane and an upper dielectric layer are formed thereon.