Abstract: An electronic component tinning apparatus comprising a longitudinal base unit having two longitudinally extending sides connected to a first end and an opposing second end, a top portion connected to and bounded by said sides and ends with an open longitudinal central cavity, and two spaced-apart, parallel longitudinally extending rails mounted on the top portion on opposing sides of said central cavity; a flux tank mounted in said central cavity approximate said first end to hold a liquid flux for flux-coating electronic component leads; a heated pot mounted in said central cavity approximate said second end to hold a hot molten solder bath for tinning the electronic component leads; a powered, wheeled electronic-component transport adapted to ride on said rails to carry electronic components from said first end over the flux tank to the second end over said solder pot and back again; two powered cam means mounted in said transport, rotatable to a high transport position and a low processing position, said c