Abstract: A method of tinning one or more electrical terminals by hot solder dipping is disclosed herein. The process generally involves placing a solder resistant material in a through hole formed in an electrical terminal, and then dipping at least a portion of the terminal into a hot solder. The solder resistant material may include, for example, a titanium or stainless steel wire, and the solder may be a tin-lead solder such as Sn63.

Abstract: A process for soldering circuit boards comprising the steps of:(a) applying a solder flux coating to the solder side of a board;(b) drying the flux on the board and preheating the solder side of the board by sequentially(i) directing a stream of warm gas over the solder side of the board,(ii) positioning the solder side of the board over a hot molten solder bath,(c) soldering the solder junctions on the board by immersing the solder side of the board into the surface of the hot molten solder bath by sequentially(i) immersing a first edge of the board into the surface of the solder bath,(ii) lowering the remainder of the board into the surface of the solder bath,(iii) longitudinally moving the board in the solder bath, and(iv) lifting the board from the surface of the solder bath at an angle to the surface of the solder bath to drain excess hot molten solder from the board.