Abstract: The present invention discloses a modular method for manufacturing circuit boards, which is a method of manufacturing multilayer printed circuit boards with blind and buried vias structure by using basic components as the assembly units. The method comprises the steps of producing electric circuits on the surface of a copper clad laminate by photolithographic and etching methods, pressing a dry film dielectric onto the surface of the laminate by the dry film lamination method after the electric circuit layer is formed, drilling a via and plugging a plastic conductive material into the via to obtain a basic component.

Abstract: The present invention discloses a modular method for manufacturing circuit boards, which is a method of manufacturing multilayer printed circuit boards with blind and buried vias structure by using basic components as the assembly units. The method comprises the steps of producing electric circuits on the surface of a copper clad laminate by photolithographic and etching methods, pressing a dry film dielectric onto the surface of the laminate by the dry film lamination method after the electric circuit layer is formed, drilling a via and plugging a plastic conductive material into the via to obtain a basic component.