Patents Assigned to Unitivie International Limited
  • Low temperature methods of bonding components
    Patent number: 6863209
    Abstract: Methods of bonding two components may include positioning the components relative to one another to obtain a desired orientation. Once the desired orientation is obtained, the components can be bonded in the desired orientation with metal wherein a temperature of both components is maintained below a melting temperature of the metal while bonding. Related structures are also discussed.
    Type: Grant
    Filed: December 14, 2001
    Date of Patent: March 8, 2005
    Assignee: Unitivie International Limited
    Inventors: Glenn A. Rinne, Krishna K. Nair
  • Methods of forming metallurgy structures for wire and solder bonding
    Patent number: 6762122
    Abstract: Metallurgy structures for input/output pads of an electronic devices can be adapted to receive both solder and wire bonds. First and second metallurgy structures, for example, can be provided on respective first and second input/output pads of an electronic device such that the first and second common metallurgy structures have a shared structure adapted to receive both solder and wire bonds. A solder bond can thus be applied to the first metallurgy structure, and a wire bond can be applied to the second metallurgy structure.
    Type: Grant
    Filed: September 27, 2001
    Date of Patent: July 13, 2004
    Assignee: Unitivie International Limited
    Inventors: J. Daniel Mis, Kevin Engel