Abstract: A structure for transmitting signals of PCI express and a method thereof provides a converting device and a high-definition multimedia interface (HDMI) cable. The converting device has a plug connector to into a PCI express slot, along with a HDMI connector. The signal converting circuit connects the signal pins of the PCI express slot to the signal pins of HDMI connector. One end of the HDMI cable is connected with the HDMI connector of the converting device. The present invention can extends the signal distance of the PCI express to exactly perform the signal test.

Abstract: A system in package (SiP) module includes a first circuit board assembly, a second circuit board assembly and a plurality of metallic pillars. The first circuit board assembly has a first top surface, a first bottom surface and a plurality of pads mounted on the first bottom surface. The second circuit board assembly has a second top surface, a second bottom surface and a plurality of second pads mounted on the second top surface. The metallic pillars are disposed between the first bottom surface and the second top surface. The metallic pillars electrically connect the first pad and the second pad.

Abstract: A soft-start circuit composed of active components and passive components and a soft-start voltage regulator based on this soft-start circuit are disclosed. The soft-start voltage regulator is coupled to a generator, a battery and a starter. When the starter is started, the soft-start voltage regulator receives the voltage of the battery to generate a soft-start signal, enabling the generator to establish a voltage. Further, after the generator established the voltage, the soft-start voltage regulator is shut off and the soft-start signal is outputted.

Abstract: An electronic package module includes a circuit board having a supporting surface, at least one first electronic component, at least one second electronic component, and at least one molding compound. The first and second electronic components are mounted on the supporting surface. The molding compound is disposed on the supporting surface and covers the supporting surface partially. The molding compound encapsulates the first electronic component yet not the second electronic component.

Abstract: A 3D stacked package structure includes a first unit, a molding unit, a conductive unit and a second unit. The first unit includes a first substrate and at least one first electronic component, and the first substrate has at least one runner and at least one first conductive pad. The molding unit includes a top portion, a frame, and at least one connection connected between the top portion and the frame. The conductive unit includes at least one conductor passing through the frame and electrically connected to the first conductive pad. Therefore, the first unit can be stacked on the second unit through the frame of the molding unit, and the first unit can be electrically connected to the second unit through the conductor of the conductive unit.

Abstract: An antenna module includes a printed circuit board, multiple conductive clamps bonded to the printed circuit board, each conductive clamp having elastic clamping arms at two opposite lateral sides thereof, and an antenna inserted in between the clamping arms of each conductive clamp and secured and electrically conducted to the printed circuit board by the conductive clamps for signal feed-in and grounding.

Abstract: An electronic module includes a circuit board, a plurality of electronic components, a plurality of molding layers, at least one first conductive layer, at least one insulating filler, and one second conductive layer. The circuit board has a first plane and at least one grounding pad on the first plane. The electronic components are mounted on the first plane and electrically connected with the circuit board. The molding layers cover the electronic components and the first plane. The trench appears between two adjacent molding layers. The grounding pad is positioned at the bottom of the trench. The first conductive layer covers the sidewall of the trench and the grounding pad. The grounding pad electrically connected with the first conductive layer. The insulating filler is positioned in the trench. The second conductive layer covers the molding layers and the insulating filler, and electrically connects with the first conductive layer.

Abstract: A package structure comprises a substrate, a plurality of first electronic components, at least a second electronic component, a first covering layer and a wiring layer. A surface of the substrate includes a first region and a second region. The first electronic components are disposed in the first region, wherein at least one of the first electronic components has a first conductive contact. The second electronic component is disposed in the second region. The first covering layer includes a recess and a first exposing region for exposing the first conductive contact. The wiring layer is formed on the recess and electronically coupled to the first conductive contact.

Abstract: An electronic device and the manufacturing method thereof are provided. The method comprises providing a module, in which the module includes a substrate, at least one component mounted on the substrate and a molding, and the molding encapsulates the component and a portion of the substrate; forming a first hole to expose a ground pad of the component; forming a first conductive layer which covers the module and is electrically connected to the ground pad.

Abstract: A holding support for electronic device is disclosed, which includes a case and a bracket. A bracket compartment is formed on the case and defined by an opening formed on the outer surface of the case. The bracket has a body and at least one finger hole formed thereon for sliding a finger through. The bracket can be retracted in or extended from the bracket compartment by being arranged at a retracted position or extended position, respectively. Therefore, the user can firmly secure the electronic device and prevent from dropping it accidentally.

Abstract: A conformal shielding module comprising a substrate, at least one electronic component mounted on the substrate, and a molding compound covering the electronic component. The molding compound includes a vertical channel extending from a surface of the molding component to the electronic component, and an electrically conductive structure formed inside the vertical channel. The electrically conductive structure is electrically connected to the electronic component and includes a testing contact on the surface of the molding compound for in-circuit test of the electronic component.

Abstract: A package structure with conformal shielding includes a substrate providing electrically connected inner grounding structures, a chip module mounted on the substrate, a molding compound covering the chip module and one surface of the substrate, and a conductive shielding layer covering the molding compound and the lateral sides of the substrate, and electrically connected with a part of the inner grounding structures. The substrate further provides one or multiple independent conductive structures electrically connected with the conductive shielding layer and exposed to the outside. By measuring the resistance value between one independent conductive structure and the conductive shielding layer or another independent conductive structure or one ground contact and then comparing the measured resistance value with a predetermined reference value, the EMI shielding performance of the package structure is determined.

Abstract: An exemplary embodiment illustrates an equalization pre-processing method, adapted for characterizing a second sound receptor unit in a sound receiving system based on knowing the internal structure parameters of a first sound receptor unit.

Abstract: The instant disclosure provides a self-sealed stacked structure which includes a substrate unit, a first frame, a conductive unit and a blocker unit. The substrate unit includes a first and a second substrate, and a first frame sandwiched there-between. The conductive unit includes a plurality of first conductors and second conductors electrically connecting the first substrate, the first frame and the second substrate. The first and the second conductors are in electrical connection. A blocker unit including at least two first and at least two second blockers are surroundingly arranged around the plurality of first and second conductors, respectively. The first substrate and the first frame are connected in a sealed manner through the first blockers combined by the solder, where the first frame and the second substrate are connected in a sealed manner through the second blockers combined by the solder.

Abstract: A structure for transmitting signals of PCI express and a method thereof provides a converting device and a high-definition multimedia interface (HDMI) cable. The converting device has a plug connector to into a PCI express slot, along with a HDMI connector. The signal converting circuit connects the signal pins of the PCI express slot to the signal pins of HDMI connector. One end of the HDMI cable is connected with the HDMI connector of the converting device. The present invention can extends the signal distance of the PCI express to exactly perform the signal test.

Abstract: A stacked substrate module includes a first and a second substrate. The first substrate has several pads which extend respectively from a stacked area of the first substrate to the outside of the stacked area. The second substrate has several welding areas arranged on the outer lateral side thereof; each welding area extends respectively from the outer lateral side of the second substrate to an upper and a lower surface of the second substrate. The second substrate is stacked in the stacked area of the first substrate, wherein the lateral side of the second substrate is aligned to the edge of the stacked area of the first substrate. The aforementioned pads correspond to the welding areas respectively. It is suitable to position a solder paste between the pads and the welding areas which can be reflowed to connect the pads and the welding areas.

Abstract: An angle-adjustable support includes a base, a carrier and a pivot mechanism. The base includes a sidewall and a bottom. The sidewall has a first pivot and a second pivot. The pivot mechanism pivotally connects the carrier with the base. The pivot mechanism has three working states. The carrier is locked when the pivot mechanism works in a first working state. The carrier is capable of pivoting relative to the base in a clockwise or anticlockwise when the pivot mechanism works in a second working state. The carrier is free to rotate when the pivot mechanism works in a third working state.

Abstract: The instant disclosure relates to an angle adjustable device, which includes: a base having a fixing member disposed thereon, where the fixing member has a fixing surface; a switch mechanism having a locking ring, a first gear, and a second gear, while at least one block protrudes from the inner surface of the locking ring, with the first gear having a contact incline slidingly abutted by the block, where the contact incline is defined with a first end and a second end, where the first gear is received by the locking ring and capable of meshing with the second gear; and a rotator having at least one connecting member connected to the second gear. The instant disclosure also discloses an electronic display unit using the same.

Abstract: The instant disclosure relates to a holding support for electronic device, which includes a case and a bracket. A bracket compartment is formed on the case and defined by an opening formed on the outer surface of the case. The bracket has a body and at least one finger hole formed thereon for sliding a finger through. The bracket can be retracted in or extended from the bracket compartment by being arranged at a retracted position or extended position, respectively. Therefore, the user can firmly secure the electronic device and prevent from dropping it accidentally.

Abstract: A chip stacked structure and method of fabricating the same are provided. The chip stacked structure includes a first chip and a second chip stacked on the first chip. The first chip has a plurality of metal pads disposed on an upper surface thereof and grooves disposed on a side surface thereof. The metal pads are correspondingly connected to upper openings of the grooves. The second chip has a plurality of grooves on a side surface of the second chip, locations of which are corresponding to that of the grooves on the side surface of the first chip. Conductive films are formed on the grooves of the first chip and the second chip and the metal pads to electronically connect the first chip and second chip. The chip stacked structure may simplify the process and improve the process yield rate.