Abstract: A circuit board assembly inspection method includes the following steps: measuring a geometrical characteristic value of a solder layer before soldering an electronic component to a circuit board and comparing the geometric characteristic value with a predetermined value and defining the grad of the solder layer according to a comparing result of the comparing step and performing a defective product process to the circuit board having an extremely bad solder layer, measuring a quality characteristic value of a solder joint layer after soldering the electronic component to the circuit board and comparing the quality characteristic value with a predetermined quality parameter value and then defining the grade of the solder joint layer according to a comparing result of the comparing step, manually inspecting the circuit board assembly having both an medium-grade solder layer a the poor solder joint layer.

Abstract: Disclosed are an electronic device and a method for unlocking screen. The electronic device includes a touch screen, a storage and a processor. The touch screen displays unlocking blocks and non-unlocking blocks in the screen-locking mode of the electronic device. A plurality of files are stored in the storage. In the screen-locking mode, the processor detects a motion track generated when an object is touching the touch screen. If the object has touched the unlocking blocks and the motion track is satisfied with a first unlocking sequence, the processor makes the screen-locking mode released and loads all files. If the object has touched the unlocking blocks and the motion track is satisfied with a second unlocking sequence, the processor makes the screen-locking mode released and loads some of the files. Thus, according to different motion tracks, the electronic device determines to load all or some of the files.