Abstract: A dual-band antenna module is provided. The dual-band antenna module includes a circuit board, a ground coupling portion electrically connected to a reference ground plane of the circuit board, a first antenna, and a second antenna spaced from the first antenna. The first antenna and the ground coupling portion are disposed on the circuit board and configured to couple each other. The first antenna includes a first radiation unit, a U-shaped conductive frame, and a first feeding portion. The U-shaped conductive frame is disposed on the first radiation unit and opens toward the circuit board. The second antenna includes a second radiation unit, a high-frequency impedance portion, and a second feeding portion. The second radiation unit and the high-frequency impedance portion are respectively disposed on two opposite surfaces of the circuit board to resonate to each other. The second radiation unit includes a ground extension portion electrically grounded.

Abstract: A radio frequency front end testing method and a radio frequency front end testing device are provided in the present disclosure. The radio frequency front end testing device includes a processing module, a first multiplexing module and a second multiplexing module. The radio frequency front end testing method includes the steps of: transmitting a radio frequency front end testing control signal; switching a plurality of output channel terminals of the first multiplexing module and the second multiplexing module, and providing a testing data signal and a radio frequency front end testing clock signal to a plurality of devices under test; and executing a test procedure on the devices under test based on the testing data signal and the radio frequency front end testing clock signal.

Abstract: A method of manufacturing electronic module is provided. The method can perform selective partial molding by forming the tapes in a predetermined area on the circuit substrate, setting electronic components out the predetermined area on the circuit substrate, forming the molding member encapsulating the whole circuit substrate and removing the tapes along of the molding member thereon. Following, forming an EMI shielding layer on the molding member and setting optoelectronics in the predetermined area on the circuit substrate could protect the electronic components from electromagnetic disturbance and avoid the optoelectronics being encapsulated.

Abstract: The present disclosure provides a wireless Ethernet network controlling method, for connecting a mobile device to an Ethernet through a wireless dock, comprising: connecting an Ethernet PHY of a wireless dock to an Ethernet; wirelessly linking a first wireless NIC of the wireless dock to a second wireless NIC of a mobile device; a control server unit of the wireless dock receiving an operation status setting signal through the first wireless NIC generated by a virtual Ethernet NIC, and the control server unit transmitting the operation status setting signal to the Ethernet PHY for setting-up the operation status of the Ethernet PHY; and a VLAN unit processing the data packets transmitted between the Ethernet PHY and the first wireless NIC. Accordingly, the user of the mobile device can experience the complete functions of the Ethernet device.

Abstract: A method of manufacturing electronic package module is provided. The method provides selective molding by attaching tapes on the circuit substrate on which electric components are mounted thereon, forming molding compound to cover the circuit substrate, and removing tapes along with the molding compound thereon.

Abstract: A method for making EMI shielding layer on a package is disclosed to include the steps of: a) disposing a UV curable adhesive which can be thermally released on a light-transmissive substrate; b) placing the package on the UV curable adhesive in such a way that the UV curable adhesive adheres to and cover a surface of the package having solder pads; c) irradiating UV light toward the light-transmissive substrate to cure the UV curable adhesive; d) forming an EMI shielding layer on the package; and e) thermally releasing the UV curable adhesive.

Abstract: A voltage regulator, an operation method thereof, and a voltage regulating system, and a mobile vehicle are provided. The voltage regulator coupled to an alternator and a battery includes a voltage detection unit which is coupled to the alternator and a startup assisting unit. The voltage detection unit operatively generates an enable signal responsive to an output voltage of the alternator. The startup assisting unit is coupled to the alternator, the battery, and the voltage detection unit. The startup assisting unit operatively generates a first exciting current to excite a rotor coil according to the enable signal. When the voltage detection unit detects that the output voltage is greater than a predetermined voltage threshold, the voltage detection unit outputs the enable signal causing the startup assisting unit to generate the first exciting current to the rotor coil, thereby facilitating the alternator to establish voltage under low rotational speed.

Abstract: A manufacturing method of electronic packaged device includes the following. A plurality of electronic components is disposed on a substrate carrier. An encapsulating member is disposed on the substrate carrier and covers the electronic components. The substrate carrier is separated from the encapsulating member. A plurality of first trenches is arranged on a first surface of the encapsulating member. Conductive material is disposed onto the first surface and into the first trenches to form a conductive layer. The conductive layer is patterned on the first surface to form a circuit layer. The circuit layer includes at least one grounding pad. A plurality of second trenches is arranged on a second surface of the encapsulating member. At least one shielding structure is formed in the first trenches and the second trenches. An electromagnetic shielding layer is connected to the grounding pad.

Abstract: The present disclosure relates to a wireless communication structure, including a plate, a first antenna, a first magnetic material layer, and a second magnetic material layer. The plate has a first surface, a second surface opposite to the first surface, and a lateral surface extending between the first surface and the second surface. The first antenna is located in the plate. The first magnetic material layer is adjacent to the lateral surface of the plate. The second magnetic material layer is located on the second surface of the plate.

Abstract: The present invention provides an antenna module and an antenna thereof. The antenna includes a first radiation element, a second radiation element, a third radiation element, and a short-circuit portion. The second radiation element has one end connected with the first radiation element. The third radiation element connected with the other end of the second radiation element, and includes a first connection section, a second connection section, and a third connection section. The first connection section is perpendicular to the second radiation element. The second connection section connected with the first connection section. The third connection section is connected with the second connection section and located at an internal side of the second connection section. The short-circuit portion connected with the second connection section and located at an external side of the second connection portion.

Abstract: The disclosure illustrates a NFC antenna. The NFC antenna includes a first radiating portion and a second radiating portion. The first radiating portion is formed by a first conducting wire surrounding an axis core. The second radiating portion is formed by a second conducting wire surrounding the same axis core based on a surrounding direction which the first radiating portion surrounds the axis core. A second signal input terminal of the second radiating portion is electrically connected to a first signal input terminal of the first radiating portion. An open end of the second radiating portion is disposed proximately to a first signal output terminal. Thus, the NFC antenna can reduce the interferences affected from surrounding metal elements, and improve a quality factor of the NFC antenna.

Abstract: A supporting structure and a docking station using the same are provided. The supporting structure includes an elastic member, a sliding member, a lifting element and a damper. The sliding member having an inclined plane is connected to the elastic member. When the elastic member receives a force, the elastic member forces the sliding member to move along an axis line with the inclined plane facing to the lifting element. The lifting element is arranged over a travel path of the inclined plane and has an abutting portion. When the lifting element receives another force so that the abutting portion abuts against the inclined plane, the sliding member stops moving and the height position of the lifting element is fixed. The damper is mated with the sliding member to slow down the velocity of the sliding member.

Abstract: The present disclosure provides a control circuitry used in a computing system, for enabling or disabling a standby module of a power supply. The control circuitry is electrically coupled to two nodes of the standby module, and comprises a determination circuit, a transistor, and an optical coupler. The present disclosure further provides a power saving method used in a computing system is illustrated. Whether the computing system is turned off is determined. If the computing system is turned off, a setting that whether the turned off computing system requires the standby voltage is judged. If the turned off computing system does not require the standby voltage, a standby module of a power supply is disabled.

Abstract: A housing assembly, including a top housing, a bottom housing and an accommodation, is provided. The top housing has a top plate, and a first sidewall extending therefrom. The bottom housing has a bottom plate, and a second sidewall extending therefrom. The engagement slit is defined by an upper edge and a lower edge in order to mate with a printed circuit board. The second sidewall includes an inclination wall extending from the lower edge of the engagement slit and distancing from the accommodation outwardly and downwardly, and an slot being adjacent to the inclination wall. The first sidewall includes a fringe protrusion, which slides along the inclination wall of the second sidewall to engage with a distal end of the inclination wall, and the top housing connects to the bottom housing thereby. The housing assembly is advantageous of easy and convenient assembly and disassembly.

Abstract: A smart module card and using method thereof are provided. The smart module card can be implemented in a peripheral platform having a transmitting port. The smart module includes a connecting port and a processing unit electrically connected thereto. The connecting port corresponds to the transmitting port, and the processing unit includes a plurality of functional chips. When the connecting port is electrically connected to the transmitting port, the processing unit receives an identification data provided by the peripheral platform to determine a plurality of predetermined operating functions required by the peripheral platform to be enabled, and the processing unit executes some of the functional chips to correspondingly enable the predetermined operating functions.

Abstract: A multi-band antenna and electronic device are provided. The multi-frequency antenna includes a feeding portion, a shorting portion, a radiating portion and a loop radiating portion. One end of the feeding portion is electrically connected to a signal source. One end of the shorting portion is electrically connected to a ground plane. The radiating portion is electrically connected to another end of the shorting portion and another end of the feeding portion. The loop radiating portion is electrically connected to the radiating portion.

Abstract: A wireless module includes a flex substrate, an antenna integrated in the flex substrate and electrically connected to a signal layer and a ground layer of the flex substrate, a first rigid substrate stacked on one side of the flex substrate remote from the antenna, and a communication unit mounted on the first rigid substrate and electrically connected to the signal layer. Thus, the flex substrate and the first rigid substrate are laminated into a Rigid-Flex board. Further, the signal layer and the ground layer are continuously arranged in the same flex substrate. It will be helpful in decreasing the uncertainty and loss of RF signal transmission path, reducing component costs, facilitating optimization of the antenna and reducing the module size.

Abstract: Provided is a motion monitoring method for monitoring a user's motion state with a motion monitoring device, sending an alert signal from the motion monitoring device to remind the user and displaying user data for recognizing the user when the motion monitoring device detects that the user's motion state does not generate any variation within a predetermined period of time or a generated variation is less than a standard value, and sending a distress signal from the motion monitoring device to specific and/or nonspecific persons if the alert signal is not turned off after the motion monitoring device having sent the alert signal continuously for a while, so as to lend a helping hand to the user as soon as possible.

Abstract: The present disclosure relates to an antenna structure including a first metal member and a second metal member. The first metal member includes a protruding portion. The second metal member defines a recess portion. The first metal member is separated from the second metal member. The protruding portion of the first metal member extends at least partially into the recess portion of the second metal member. The first metal member and the second metal member are located along a same plane.

Abstract: An electronic package module includes a circuit board having a supporting surface, at least one first electronic component, at least one second electronic component, and at least one molding compound. The first and second electronic components are mounted on the supporting surface. The molding compound is disposed on the supporting surface and covers the supporting surface partially. The molding compound encapsulates the first electronic component yet not the second electronic component.