Patents Assigned to Valtech Corporation
  • Method for preparing semiconductor wafers
    Patent number: 4897141
    Abstract: Profound improvements and advantages are realized in the process of cutting semiconductor ingots to provide wafers if the adhesive used to bond said ingot to a mounting or cutting beam contains hollow microspheres.
    Type: Grant
    Filed: June 9, 1988
    Date of Patent: January 30, 1990
    Assignee: Valtech Corporation
    Inventor: Richard T. Girard