Abstract: Process for the production of a resist coating, in which (a) a substrate is coated with a resist composition which comprises at least one component which absorbs radiation in the near infrared region with warming of the coating; and (b) the resist composition or a composition derived therefrom and obtained during the process is subjected at least once during the process to thermal treatment with the aid of radiation in the near infrared region.

Abstract: Two sided printed circuit boards with very small rings surrounding the plated though holes can be produces by starting with a through-plated copper laminate, and coating it with a liquid negative electrodeposition photo-resist. The coated photo-resist is exposed to light through a mask set up so that the light does not shine on the through-platings. The non-crosslinked photo-resist is subsequently removed. A metal or a metal alloy resist is laid down by electrodeposition on those surfaces from which the non-crosslinked photo-resist has been removed. Finally, the crosslinked photoresist material is removed and the exposed copper laminate is treated with a copper-etching solution to completely remove the copper surface that has been uncovered.

Abstract: A curable epoxy resin composition comprising (a) a cycloaliphatic epoxy resin that is liquid at RT and, suspended therein, a core/shell polymer, (b) a polycarboxylic anhydride and (c) fillers, wherein the composition is flame-retardant because two different fillers (c1) and (c2) are present, the nature of filler (c1) being such that, starting at RT, it is able to release water as the temperature rises, the total proportion of fillers (c1) and (c2) is from 58 to 73% by weight, based on the total amount of components (a), (b), (c1) and (c2), and the ratio by weight of the fillers (c1):(c2) is from 1:3 to 1:1, is suitable as a casting resin, especially in the impregnation of electrical coils and in the production of electrical components, such as air-cooled transformers, bushings, insulators, switches, sensors, converters and cable end seals.

Abstract: The invention relates to a method for producing sequentially built-up printed circuit boards having a disparate number of conduction planes on both sides of the laminate core, which method comprises the following method steps: (A) coating both sides of a printed circuit board having conductor structures on only one side with a dielectric comprising a photopolymer or a thermally curable polymer; (B) structuring the plating holes (vias) on the side having the conductor structures by exposing the dielectric comprising a photopolymer to light and then developing with a solvent or by laser-drilling the plating holes (vias) into the dielectric comprising a thermally cured polymer; (C) depositing a copper layer on both sides of the board so obtained; (D) forming conductor structures on the front and completely etching away on the rear, if further asymmetric build-up is to be carried out, or on both sides of the printed circuit board if there is to be no further build-up or if further build-up is to be carried ou

Abstract: The present invention relates to a process for the fast and efficient filling of voids of both simple and complex shape which can be carried out at room temperature. In particular, the present invention consists of the use of free flowing thermally expanding and curing powders which are poured into the voids and then heated causing the powder to expand, coalesce and cure and thus filling or partially filling the void space as required. The process according to the present invention is particularly suitable for filling the spaces in, around and between honeycomb or pre-formed foam cores as required to produce a filled or partially filled honeycomb or foam core or any other material used in sandwich panel construction. This process is also a simple and efficient method for filling moulds suitable for use in cellular artefact production. The filled or partially filled mould or honeycomb core can then be cured to produce bonded sandwich panels or moulded cellular artefacts.

Abstract: The method of manufacturing a sheet stack for electromagnetic assemblies, consisting of ferromagnetic material, includes forming the sheet stack from raw magnetic steel sheets in a shaping tool without the use of spacers, if necessary with the help of positioning aids, and simultaneously introducing a hardenable mixture into the shaping tool in order to totally surround the sheet stack and to form an anti-corrosion layer and hardening or hardening out this casting compound according to the pressure-gelating method to connect the sheets together and to form the finished sheet stack in one single working step.

Abstract: Powder coating compositions comprise a binder selected from carboxyl-group-containing polyesters, carboxyl-group-containing poly(meth)acrylates and mixtures of the said substances, and one or more novel epoxy compounds.

Abstract: The present invention relates to compositions comprising A composition comprising (a) a resin containing a polyepoxide and a polyisocyanate, and (b) a treated filler which is either a silane-treated filler or an atomised filler, The compositions are suitable for the fabrication of high performance resin molds which can then be used for various molding methods such as injection molding, press molding, vacuum molding, high pressure molding or foaming molding.

Abstract: The present invention relates to a process for preparing resin impregnated wire windings by trickling an impregnating resin onto a heated rotating winding or by dipping the heated rotating winding in a bath filled with an impregnating resin. The impregnating resin comprises an epoxy resin and an initiator for the polymerization of the epoxy resin. The initiator is either a selected compound that is activated by ultraviolet irradiation, a heat-activatible initiator, or a mixture thereof. The heat-activatible initiator is a mixture comprising at least one quarternary ammonium salt and at least one thermal radical former.

Abstract: A composition comprising (a) an epoxy resin having, on average, more than one 1,2-epoxy group per molecule, (b) a polyol as epoxy resin curing agent and (c) a solid microgel-amine adduct as accelerator has high latency, good storage stability and a wide processing window.

Abstract: Heat curable compositions comprising: (A) at least one compound which is capable of undergoing cationic polymerization; (B) at least one quaternary ammonium salt of an aromatic-N-heterocyclic cation and of a non-nucleophilic anion; (C) at least one 1,1,2,2-substituted-1,2-ethane-diol and/or a derivative thereof, and (D) optionally further additives; and wherein said component (C) is a compound of formula (I), wherein each of R1, R2, and R3 independently of the other is unsubstituted phenyl or has one of the meanings of R4; R4 is substituted phenyl optionally substituted &agr;-naphthyl or &bgr;-naphthyl, or an optionally substituted aromatic heterocyclic ring system or each of R1 and R2 and/or R3 and R4 independently of the other form a residue of formula (II), wherein each of R5 and R6 independently of the other is hydrogen or (C1-C4)alkyl; R7 is —(CH2)n— or —S— or —O—; and n is 0, 1, 2, or 3.

Abstract: Soluble poly(bis-9,9′-fluorenes) comprise identical or different structural repeating units of the formula I, where the two R1s are, independently of one another, H, C1-C18alkyl, C8-C14aryl, C7-C15aralkyl, C1-C18alkoxy, R2—(O—CnH2n)m—O—, C1-C18alkylthio, C1-C18dialkylamino, —C(O)OH, —C(O)O—C1-C18alkyl, —C(O)—N(C1-C18alkyl)2, —SO3H, —SO3—C1-C18alkyl, —SO2—N(C1-C18alkyl)2, C1-C17-alkyl-C(O)—O— or C1-C17alkyl-C(O)—, R2 is H or C1-C12alkyl, n is from 2 to 6 m is from 1 to 12. The polymers can be used either alone or in admixture with at least one additional fluorophore whose absorption band overlaps the emission band (fluorescent emission) of the polymer of the formula I as active radiative layer for light-emitting diodes, VDUs and display elements.

Abstract: A process for impregnating an electrical coil which comprises a winding comprising two or more layers consisting of more than one turn of an electrically conducting wire-form material with a polymer material which electrically insulates the individual turns of the wire-form material from one another with the aid of a thermally curable epoxy resin composition, which composition is solid at room temperature and comprises the following constituents: (a) an epoxy resin which is solid at room temperature, selected from (a1) polyglycidyl ethers based on novolaks; (a2) diglycidyl ethers based on bisphenols, and (a3) mixtures of more than one of components (a1) and (a2); (b) a crosslinking agent for component (a); (c) a suitable accelerator for the reaction of component (a) and component (b); (d) from 15 to 70 percent by weight, based on the overall weight of the composition, of filler selected from (d1) calcium carbonate, (d2) quartz flour, (d3) wollastonite whose particles have an average ratio of length

Abstract: A process for the manufacture of a flowable granulate by means of spray granulation, which comprises using as starting material a formulation in liquid form comprising (a) a substance or a mixture of substances that is in the form of a waxy or cohesive solid at room temperature, and (b) up to 20% by weight, based on the amount of component (a), of a substance having a specific surface >3 m2/g that is insoluble in component (a), yields granulates that have a narrow particle size distribution and a low dust content and that are stable to storage.

Abstract: In a method of coating substrates, especially printed circuit boards, on both sides, one side of the substrate, which is provided with holes, is coated by a coating process, especially by screen printing, wherein the holes that are not required for the circuit layout are lastingly covered over and the holes that are required are covered over only slightly or are left clear, whereupon the other side of the substrate is coated by a coating process, especially by curtain pouring or spraying, wherein the entire surface of the substrate is provided uniformly with a coating that gives only a light covering over the holes.

Abstract: An adhesive composition comprising (a) an epoxy resin having a substantially linear structure, (b) an amine hardener, and (c) a non-ionic surfactant, is suitable for adhering low energy (composite) surfaces to rigid metal or non-metal composite surfaces/parts and can be cleanly removed after use by application of heat.

Abstract: A rotary trowel (1) for use in the molding of ceramics (15) comprising a trowel matrix (2) and a trowel surface (3) provided on said trowel matrix (2) so as to make contact with a raw clay composition (15) and calender the raw clay composition (15), characterized in that said trowel surface (3) is formed by providing an epoxy resin composition containing an abrasion-resistant material on the inner surface of a casting mold (6).

Abstract: The invention provides a process for treating a metallic surface, other than a clean aluminum or aluminum alloy surface, which comprises treating the surface with an organosilane and exposing the surface to a laser.

Abstract: A curable epoxy resin formulation comprising a) 40 to 100% by weight of an epoxy group-terminated polyester of a dimerised or trimerised fatty acid and a polyhydric alcohol, and 0 to 60% by weight of a diepoxide which is not an epoxy group-terminated polyester, b) a hardener for epoxy resins consisting of 50 to 99% by weight of a polyoxyalkylene di- or triamine and 1 to 50% by weight of a hardener which is not a polyoxyalkyleneamine, and comprising as further optional components c) a curing accelerator, and d) customary modifiers for epoxy casting resins, with the proviso that the sum of the constituents in component a) as well as in component b) is in each case 100% by weight, is suitable for use as casting resin formulation for encapsulating electrical or electronic components.

Abstract: Novel epoxy acrylates and carboxyl group-containing epoxy acrylates of formulae II and III of the claims that are relatively highmolecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerised polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.