Abstract: A verification system for capsules, tablets and the like includes a test block having a slot through which the capsules are directed by a conveyor. The test block includes first and second spaced sensing planes each having bifurcated fiber optic input and output arrays on the top and both sides of the slot. An optical system provides a planar light beam for sensing the position of the capsules being tested at the output from the test block. The length of the capsule is determined from the speed of the conveyor and the time of interruption of planar light beam. If the capsule is not of the proper colors and length, it is pneumatically ejected into a rejection chute.

Abstract: A hollow dipstick is provided for immersion in molten material to determine the temperature of the molten material at any desired depth. The hollow dipstick is connected to an infrared detector by means of an optical fiber bundle for producing a signal indicative of the temperature of the molten material. An infrared focusing lens is provided within the hollow dipstick for transmitting the infrared radiation from the interior bottom surface of the dipstick to the fiber optic bundle. A container having a heating element therein is provided for receiving the dipstick when it is not in use so as to preheat the dipstick to a temperature close to the estimated temperature of the molten material to be measured to thereby prevent thermal shock to the dipstick upon immersion in the molten material. Alternatively the infrared detector is mounted directly on the dipstick.

Abstract: A system for placing, soldering and inspecting component parts, such as soldered joints and electronic components, on a printed circuit board utilizes a transfer device for selecting and transferring specific electronic component parts to predetermined positions on a printed circuit board and holding each component part in the desired position by use of the transfer device during a reflow soldering operation to mechanically and electrically connect the component part to the printed circuit board. The reflow soldering utilizes a laser beam for injecting thermal energy into each soldered joint to melt the soldered material. An infrared detector senses thermal radiation and/or reflected radiation from the heated solder material to discontinue the application of the laser beam to the solder material upon liquifaction of the solder material.

Abstract: A system for placing, soldering and inspecting component parts, such as soldered joints and electronic components, on a printed circuit board utilizes a transfer device for selecting and transferring specific electronic component parts to predetermined positions on a printed circuit board and holding each component part in the desired position by use of the transfer device during a reflow soldering operation to mechanically and electrically connect the component part to the printed circuit board. The reflow solderiung utilizes a laser beam for injecting thermal energy into each soldered joint to melt the soldered material. An infrared detector senses thermal radiation and/or reflected radiation from the heated solder material to discontinue the application of the laser beam to the solder material upon liquifaction of the solder material.

Abstract: The melting of solder in a reflow soldering operation is detected by examining the rate of change of the solder temperature or by detecting a change in a surface reflectance characteristic of the solder which occurs upon melting.

Abstract: An apparatus for inspecting a device made up of a plurality of different infrared radiating elements includes an optical head which is moveable along X-Y coordinates above the fixed device to sequentially scan the infrared radiating elements. A laser beam source is operatively connected to the moveable head for injecting thermal energy into the infrared radiating elements and an infrared detector is provided for sensing the infrared radiation emanating from the elements. The infrared detector may be mounted directly on the moveable head or in a remote location wherein the detector would be connected to the moveable head by a flexible optical fiber. A second moveable head may be located on the opposite side of the device so that thermal energy from the laser source may be injected into opposite sides of the infrared radiating element.