Abstract: A conveyor device for the conveying workpieces, specifically circuit boards. The conveyor device is equipped with a primary and secondary conveyance for conveying the workpiece along a first or second partial path of the conveyance path. Workpieces are fed to the first partial path via the second partial path. Separators operate along the first partial path to separate one workpiece from a trailing workpiece. The Separators feature at least one spacer which can be moved and displaced by a control. After the workpiece passes the starting position, the spacer switches into an active mode, in which it is placed behind the workpiece and tracks it, thereby forming a minimum spacing between the workpiece and the trailing workpiece, and upon reaching the ending position, the spacer switches into an inactive mode, in which the spacer returns to the starting position.

Abstract: The invention relates to a conveyor device (2) for the conveyance of workplaces (4, 6, 8), specifically of circuit boards, in the conveyance direction (T) along a conveyance path (10). The conveyor device (2) is equipped both with primary conveyance means (18) and with secondary conveyance means (22) for conveyance of the workpiece along a first or second partial path (20, 24) of the conveyance path (10), wherein workplaces (4, 6, 8) are fed to the first partial path (20) via the second partial path (24).

Abstract: A through-substrate optical imaging device for through-imaging of translucent work objects, includes a radiation source outputting radiation that will be transmissive through the work object and an imaging system configured for capturing inspection information from the radiation source through the work object. The radiation source is configured such that the radiation impinges on the surface of the work object under various angles of incidence. A method for through-substrate optical imaging of a translucent work object includes irradiating the translucent work object by radiation from a radiation source; capturing inspection information from the radiation source through the translucent work object, the inspection information being captured by an imaging system; and irradiating the translucent work object. The translucent work object is irradiated by radiation which impinges on the surface of the translucent work object under one of various angles of incidence and orientations.