Patents Assigned to Visicon Inspection Technologies, LLC
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Patent number: 8811691Abstract: Apparatus, systems, and methods for inspecting longitudinal surfaces and sidewalls of cut tubes are disclosed. In some embodiments, the apparatus includes a line camera, the line camera being configured to capture images of longitudinal surfaces of the cut tubes, an area camera joined with the line camera, the area camera being configured to capture images of sidewalls of the cut tubes, a mandrel and drive, a multi-axis motion stage, a vertical motion stage, and a rotating motion stage. In some embodiments, the system includes a camera module, a tube positioning module, a motion control module, and an analysis module. In some embodiments, the method includes positioning a line and area cameras, moving the cut tubes, capturing images of the longitudinal surfaces and sidewalls of the cut tubes, providing comparable images of a template cut tube, and comparing the images of the cut tubes to those of the template cut tube.Type: GrantFiled: June 5, 2007Date of Patent: August 19, 2014Assignee: Visicon Inspection Technologies LLCInventor: Daniel Freifeid
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Patent number: 7619646Abstract: An optical system is effective to illuminate and scan an interior wall of an object having an interior bore, such as a stent. The system includes a light source, an object support having a light conducting portion, an image taking lens, and a line scan camera. The interior bore and the light conducting portion of the object support are in axial alignment with a center optical axis of the image taking lens. A drive mechanism engages the object without impacting the axial alignment. Various aspect of this optical system include a rotating wheel or transparent plate as the drive mechanism. The object support may be an opaque rod having a light conducting portion or a transparent rod.Type: GrantFiled: March 6, 2007Date of Patent: November 17, 2009Assignee: Visicon Inspection Technologies LLCInventors: Daniel Freifeld, John B. Burnett
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Patent number: 6879403Abstract: A system for measuring the spatial dimensions of a three-dimensional object employs a lens and at least two detectors. The combination of which defines two or more object planes. The combination of the lens and the detectors define an optical axis that is normal to the object planes and passes through a focal point of the lens. At least a first and a second photodetector are optically aligned with the object through the lens. The first and second photodetectors or array of detectors are further parallel with the surface but have differing elevations relative to that surface. In addition, the first and second photodetectors are capable of motion relative to said object. Electrical output from the first and from the second photodetectors is provided to a processor that determines a distance of the object from the lens and thereby a height of the object. This system is particularly suited for measuring the spatial dimensions of solder balls mounted to a surface of a ball grid array (BGA) electronic package.Type: GrantFiled: March 11, 2004Date of Patent: April 12, 2005Assignee: Visicon Inspection Technologies, LLCInventor: Daniel Freifeld
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Publication number: 20020054299Abstract: A system for measuring the spatial dimensions of a three-dimensional object employs a lens and at least two detectors. The combination of which defines two or more object planes. The combination of the lens and the detectors define an optical axis tat is normal to the object planes and passes through a focal point of the lens. At least a first and a second photodetector are optically aligned with the object though the lens. The first and second photodetectors or array of detectors are further parallel with the surface but have differing elevations relative to that surface. In addition, the first and second photodetectors are capable of motion relative to said object. Electrical output from the first and fix the second photodetectors is provided to a processor that determines a distance of the object from the lens and thereby a height of the object. This system is particularly suited for measuring the spatial dimensions of solder balls mounted to a surface of a ball grid array (BGA) electronic package.Type: ApplicationFiled: September 21, 2001Publication date: May 9, 2002Applicant: Visicon Inspection Technologies LLC, a corporation of the State of ConnecticutInventor: Daniel Freifeld