Abstract: This application discloses a standoff device for surface-mounting light emitting diodes (LEDs). In some embodiments, the standoff has asymmetric features to control orientation of a part in tube or reel packaging. The standoff has a broad base to keep the part upright during the reflow process. The standoff has a lifted bottom surface to allow room for solder flowing onto leads. The standoff has lead holes spaced at a standard distance to hold many different LEDs. In addition, the standoff has a variable height designed to allow one mold to make parts of different heights.