Abstract: A method of providing a resistance to oxidation of Nickel at high temperatures by combining Ni powder with five percent Pt resinate, and heating the same to a temperature of 500° C. to 1300° C. Electro-conductive components serving as electrodes and the like comprise a Ni/Pt powder subjected to temperatures of between 500° C. and the respective melting points of Ni and Pt.

Abstract: A method of providing a resistance to oxidation of Nickel at high temperatures by combining Ni powder with five percent Pt resinate, and heating the same to a temperature of 500° C. to 1300° C. Electro-conductive components serving as electrodes and the like comprise a Ni/Pt powder subjected to temperatures of between 500° C. and the respective melting points of Ni and Pt.

Abstract: A method of providing a resistance to oxidation of Nickel at high temperatures by combining Ni powder with five percent Pt resinate, and heating the same to a temperature of 500° C. to 1300° C. Electro-conductive components serving as electrodes and the like comprise a Ni/Pt powder subjected to temperatures of between 500° C. and the respective melting points of Ni and Pt.

Abstract: A method of creating a multilayer ceramic component of the present invention is used to spontaneously create vias between adjacent conductor layers in a multilayer inductive component. After a first conductive layer is printed, a via dot is printed on the first conductive layer. Next, a controlled thickness of ceramic slurry is cast over the previous ceramic layer, first conductive pattern, and the via dot. The physical/chemical forces between the via dot and the ceramic slurry expel the slurry in the proximity of the top surface of the via dot. When the ceramic slurry dries, the ceramic cast leaves vias filled with conductors from the preprinted via dots. This process is repeated until a desired number of conductive layers are formed.

Abstract: Method for making novel, dip-coated monolithic ceramic capacitors from a pair of parallel integral multi-lead carrier strips 10 and 10a. Each of a plurality of capacitor bodies 18 is positioned and restrained between the wide contact faces 15, 15a of a pair of leads 13, 13a, soldered and dip-coated while the leads 13 and 13a are retained as integral parts of the carrier strips 10 and 10a.

Abstract: A lead wire for a miniature capacitor having a U-shaped clamp at one end and being removably attached to a carrier, such as a sprocketed ribbon, at the other end. Each of the U-shaped clamps grasps and holds a terminal end of the capacitor. The carrier is used with conventional geared wheels and reels to move the capacitors and lead wires from station to station during their assembly procedure. When assembly is completed, the leads can be removed from the carrier.

Abstract: Incrementally adjustable multilayer monolithic capacitors having a set of base electrodes extending to and being coextensive with a first terminal end surface of the capacitor and a set of incremental electrodes extending to and being coextensive with a side surface of the capacitor. The base electrodes are electrically interconnected by a conductive metal coating on the first terminal end surface. Capacitance values of the resultant capacitor can be incrementally adjusted by electrically interconnecting or disconnecting one or more of the incremental electrodes either along the side surface to which they extend and are coextensive with or along the second terminal end surface of the capacitor.