Abstract: The invention relates to a method for soldering an object comprising several soldered joints. The method comprises the steps of mechanically soldering of at least some of the soldered joints, visually assessing the soldered joints, and correctively soldering the visually assessed soldered joints that do not meet the relevant quality requirements. The visual assessment takes place by means of a video camera and a computing device connected to the video camera. The assessment criteria for the soldered joints are stored in the computing device. The invention also relates to an apparatus for carrying out the method.

Abstract: The invention relates to a method for soldering an object comprising several soldered joints, which method comprises the steps of mechanically soldering of at least some of the soldered joints, visually assessing the soldered joints, and correctively soldering the visually assessed soldered joints that do not meet the relevant quality requirements, wherein said visual assessment takes place by means of a video camera and a computing device connected to the video camera, in which computing device the assessment criteria for the soldered joints are stored.

Abstract: The invention relates to an apparatus for visually inspecting soldered joints made on a soldered object, comprising: A camera for recording at least one image of the soldered object on which the soldered joints to be soldered are present, a computing device connected to the camera for receiving the signals from the camera that represent the images recorded by the camera, the computing device being arranged for comparing the signals with signals which are representative of correct soldered joints, and a handling device for moving the soldered objects on which the soldered joints to be inspected have been made to a position within the viewing range of the camera.

Abstract: The invention relates to a soldering apparatus, including a vessel for containing and heating molten solder, transporting means for transporting objects for soldering to the vessel and removing said objects, at least one tube extending substantially vertically above the soldering vessel, pump means for feeding molten solder to the underside of the tube, and moving means for moving into at least the vicinity of each other the underside of the printed circuit board for soldering and the upper side of the tube, wherein an outflow opening is arranged in each of the tubes at some distance from the upper side of said tubes. By arranging the outflow opening at some distance from the upper side of the tube the outflowing solder flow will no longer contact the printed circuit board and the components present thereon thus allowing more freedom in the design of the printed circuit board and the placing of the components thereon.

Abstract: A method for separating dross floating on solder into solder and a residue, comprising of repeatedly cutting through the dross with at least one knife extending substantially parallel to the direction of movement and removing the residue from the solder. The invention also relates to an apparatus for separating dross floating on solder present in a vessel into solder and a residue, wherein the apparatus comprises at least one knife which is movable along a path extending through the vessel, and wherein the at least one knife is adapted to cut through the dross during the movement along the path. Due to the above stated cutting operation the units of the dross formed by nuclei of solder enveloped by metal oxides are destroyed, whereby the solder enveloped by metal oxides are destroyed, whereby the solder is released and added to the solder already present in the bath, and the released metal oxide will float on the solder. A considerable volume and mass reduction of dross to metal oxide herein takes place.

Abstract: The invention relates to a soldering apparatus, including a vessel for containing and heating molten solder, transporting means for transporting objects for soldering to the vessel and removing said objects, at least one tube extending substantially vertically above the soldering vessel, pump means for feeding molten solder to the underside of the tube, and moving means for moving into at least the vicinity of each other the underside of the printed circuit board for soldering and the upper side of the tube, wherein an outflow opening is arranged in each of the tubes at some distance from the upper side of said tubes. By arranging the outflow opening at some distance from the upper side of the tube the outflowing solder flow will no longer contact the printed circuit board and the components present thereon thus allowing more freedom in the design of the printed circuit board and the placing of the components thereon.