Abstract: A system and method that obtains contact heights of a packaged chip. In particular, the system includes a first light source for emitting direct light, a second light source for emitting structured light, two or more cameras pointed towards the packaged chip for capturing a first set of images of the packaged chip, and a second set of images of the packaged chip, and at least one processor that processes the first set of images and the second set of images captured by the cameras to determine contact heights of the packaged chip. The cameras capture the first set of images when the first light source emits direct light towards the packaged chip, and capture the second set of images when the second light source emits structured light towards the packaged chip.

Abstract: An apparatus for use in an automated optical inspection in a production line, the apparatus including a frame accommodating a plurality of illumination units surrounding an integrated optical imaging unit, wherein each illumination unit is rotatable in a synchronized manner relative to each unit, in use, to vary an illumination angle at an intended target, to enhance the visualization of the intended target captured by the optical imaging unit.

Abstract: An apparatus for use in an automated optical inspection in a production line, the apparatus including a frame accommodating a plurality of illumination units surrounding an integrated optical imaging unit, wherein each illumination unit is rotatable in a synchronized manner relative to each unit, in use, to vary an illumination angle at an intended target, to enhance the visualization of the intended target captured by the optical imaging unit.