Patents Assigned to VLSI Technolgy, Inc.
  • Method and apparatus for improved copper plating uniformity on a semiconductor wafer using optimized electrical currents
    Patent number: 6193860
    Abstract: An apparatus for optimizing electrical currents to improve copper plating uniformity on a semiconductor wafer is disclosed. The use of multiple anodes of the embodiment provides for variable electrical currents to the semiconductor wafer, the variable feature of the variable electrical currents compensating for non-uniform electroplating characteristics.
    Type: Grant
    Filed: April 23, 1999
    Date of Patent: February 27, 2001
    Assignee: VLSI Technolgy, Inc.
    Inventor: Milind Weling