Patents Assigned to WACKER SILTRONIC GESELLSCHAFT FOR HALBLEITERMATERIALIEN AG
  • Process for producing a semiconductor wafer with polished edge
    Publication number: 20010014570
    Abstract: There is a process for producing a semiconductor wafer having a front surface and a back surface and a polished edge, in which the semiconductor wafer is subjected to polishing on both sides.
    Type: Application
    Filed: January 30, 2001
    Publication date: August 16, 2001
    Applicant: WACKER SILTRONIC GESELLSCHAFT FOR HALBLEITERMATERIALIEN AG
    Inventors: Guido Wenski, Thomas Altmann, Gerhard Heier, Wolfgang Winkler