Abstract: A clamping heat sink formed of a thermally conductive material for releasable attachment to an electronic component. The clamping heat sink includes a horizontal base wall, a pair of vertical side walls extending upwardly from the base and a resiliently deflectable clamping element which extends downwardly from the top of each vertical wall into the rectangular channel which is formed by the base wall and vertical side walls. Each clamping element has an upper portion which extends downwardly at any angle toward the base wall and the opposite side wall and a lower portion which extends downwardly at an angle from the lower end of the upper portion toward its own side wall, the upper portion of the clamping element forming a juncture with the lower portion.

Abstract: A spring clip for clamping a heat sink module to an electronic module which has a pair of opposite side edge surfaces and a pair of spaced projections which extend from each side edge surface. The spring clip includes an elongated generally horizontal middle segment, a pair of end segments at opposite ends of the middle segment which extend in a first direction at an upward angle and a finger tab segment which is connected to the middle segment and which extends at an upward angle in a second direction which is opposite the first direction. A spring clip and heat sink assembly is formed by attaching a pair of spring clips to opposite ends of the heat sink for application to an electronic module. A heat dissipating assembly is formed by applying the spring clip and heat sink assembly to an electronic module which has a pair of projections extending from opposite edge surfaces of the electronic module.

Abstract: A heat sink for frictionally engaging an electronic device. The heat sink includes an enclosure which is formed by a pair of oppositely facing vertically side walls which extend upwardly from a flat horizontal base wall. A pair of opposed resilient clamping fingers extend toward each other and downwardly from the upper ends of the vertical side walls. Each of the clamping fingers has a free rounded end for engaging with a downward biasing force the top surface of an electronic device which is placed within the enclosure of the heat sink. A stop is located on the base wall for locating the electronic device relative to the heat sink. The heat sink also has a protuberance on the inside surface of each vertical side wall for engaging the side walls of the electronic device.

Abstract: A method of forming a unitary heat sink metal body by supporting one end of each plurality of flat metal plates or fins in a row so that the plates are spaced and parallel and casting a base about the freely extending ends of the plates. More specifically, the base is formed by die casting. Apparatus for carrying out the above method is also provided which includes a fixed base and a support for supporting a plurality of flat metal plates or fins in spaced parallel relationship so that one end of each plate engages the fixed base and the opposite end of each plate extends freely from the support. The freely extending ends of the plates are positioned within the cavity of a mold such as a die cast mold. The cavity of the mold is filled with molten metal for filling the spaces between the freely extending ends of the plates and forming the base of the heat sink when the molten metal solidifies.

Abstract: A fan driven heat sink assembly which includes a fan assembly mounted on a heat sink for mounting on a microprocessor unit. The heat sink has a solid flat base, a plurality of spaced cooling fins and a housing which is fixed to the base. The cooling fins are fixed to the base and extend from one flat surface of the base to a top wall of the housing. The top wall of the housing has an aperture which is aligned with an outlet opening of the fan assembly. The fins extend from a first end opening at one end of the housing to a second end opening at the opposite end of the housing. Airflow from the fan assembly extends from the opening in the top wall of the housing along the spaces between the fins and out through both end openings of the housing.

Abstract: A spring clip for clamping a heat sink module which has a plurality of upwardly extending cooling elements to an electronic module. The spring clip includes a horizontal grid like foot portion which engages the upper surface of the heat sink module a vertical leg portion which extends along the side of the heat sink module and the electronic module and a bendable and resilient connecting portion which extends from the inner end of the foot portion to the upper end of the leg portion. The electronic module has a first latching element at its side surface for engaging a complementary second latching element which forms part of the vertical leg portion of the spring clip. The spring clip is rendered from a non-clamping position in which the latching element of the clip is above the latching element of the electronic module to a clamping position by bending the connecting portion downwardly from its inner end to lower the vertical leg portion so that the first and second latching elements are engaged.

Abstract: A self clamping heat sink for releasable connection to an electrical component having a bottom surface and a top surface. The self clamping heat sink includes a base and a pair of inverted U-shaped spring arms at opposite sides of the base which extend upwardly from the base. A clamping finger extends inwardly from the outer leg portion of each spring arm to a free end which overlies the base. The free ends of the spring arms are raised to an upper position relative the base by applying external force to squeeze the outer leg portions of the spring arm toward each other. This enables an electrical component to be placed on the base and below the free ends of the clamping fingers. When external force is removed from the spring arms, the clamping fingers try to return to their normal lower position and engage the top surface of the electrical component so that the electrical component is clamped between the base and the fingers.

Abstract: A spring clip for clamping a heat sink module to an electronic module. The heat sink module has a flat upper surface and a plurality of vertical cooling elements which extend upwardly from the upper surface of the heat sink module. The clip includes a central potion which engages the upper surface of the heat sink module and a pair of oppositely extending resilient end potions which are cantilevered from the central potion. A vertical leg portion is connected to the free end of each end portion of the clip and extends downwardly along one of the end surfaces of the electronic module. Each leg potion has an inwardly extending projection which has an upwardly facing edge surface for engaging a downwardly facing edge surface of the electronic module at one of the lower corners of the electronic module upon downward bending of the end potion so that the projection is biased upwardly against the lower corner of the electronic module due to the resiliency of the end potion.

Abstract: A heat sink adapted for use with VLSI and other integrated circuit elements which includes a base adapted to be in thermal contact with the element to be cooled, there preferably being at least one projection from the side of the base adapted to be adjacent to the element, and a plurality of pins extending from the other side of the base in a direction substantially perpendicular thereto. The projection from the base may either be in the form of a center pedestal which is secured to the element to be cooled by a suitable adhesive, limiting the thermal stress area, or may be a plurality of projections formed in a predetermined pattern which are adapted to be in physical contact with the element and to provide a controlled standoff therefrom which defines a uniform adhesive bond line. The heat sink also preferably provides a means for reducing the temperature gradient between the center pins and peripheral pins which results from the center of the integrated circuit typically being hotter than the outer areas.

Abstract: A method of manufacturing a high fin density heat dissipator is disclosed in which the dissipator is extruded through a die in a partially cylindrical shape with the elongated fins arranged on the base and extending radially therefrom. The extruded dissipator is straightened under tensile and bumping forces in a manner such that the base assumes a planar shape and the fins become substantially parallel to each other. Apparatus for straightening the extruded dissipator and a die for extruding the same are illustrated and described.