Abstract: The present application discloses a thinning system in package featuring an encapsulation structure in which no printed circuit board exists and comprising: a plurality of dies mounted on a top face of a copper holder and electrically connected to the plurality of data pins on the copper holder; a passive element mounted on the top face and electrically connected to the dies wherein the dies are electrically connected to the ground pin of the copper holder and both the dies and the passive element are fixed on the top face of the copper holder through a layer of insulation adhesives; a molding compound encasing the dies and the passive element on the top face of the copper holder.

Abstract: The present application discloses an integration package with insulating boards, which features an insulating board structure replacing a plurality of printed circuit boards and packaging materials in a conventional POP structure and comprises a base substrate, a basic circuit and at least an electronic component: the basic circuit is exposed on an upper surface of the base substrate; the electronic component and the basic circuit are electrically connected with each other; both the base substrate and the electronic component are thermally compressed and covered by a first insulating board.

Abstract: The present application describes a system in package which features no printed circuit board inside an encapsulation structure and comprises: a copper holder with a silicon layer at a top face; a plurality of dies mounted on the silicon layer and electrically connected to a plurality of data pins of the copper holder; a passive element mounted on the silicon layer and electrically connected to the dies wherein the dies are electrically connected to the ground pin of the copper holder; a molding compound encasing the dies and the passive element on the top face of the copper holder.

Abstract: The present application discloses a thinning system in package featuring an encapsulation structure in which no printed circuit board exists and comprising: a plurality of dies mounted on a top face of a copper holder and electrically connected to the plurality of data pins on the copper holder; a passive element mounted on the top face and electrically connected to the dies wherein the dies are electrically connected to the ground pin of the copper holder and both the dies and the passive element are fixed on the top face of the copper holder through a layer of insulation adhesives; a molding compound encasing the dies and the passive element on the top face of the copper holder.

Abstract: The present application describes a system in package which features no printed circuit board inside an encapsulation structure and comprises: a copper holder with a silicon layer at a top face; a plurality of dies mounted on the silicon layer and electrically connected to a plurality of data pins of the copper holder; a passive element mounted on the silicon layer and electrically connected to the dies wherein the dies are electrically connected to the ground pin of the copper holder; a molding compound encasing the dies and the passive element on the top face of the copper holder.

Abstract: The present disclosure relates to a device authentication method as a procedure designed for authenticity of an apparatus. A connecting apparatus to be authenticated and an authentication box are connected to a trusted network through which authentication information is received by the connecting apparatus. The connecting apparatus is electrically connected to a non-trusted network through which the connecting apparatus and an intermediary server are electrically connected with each other; a virtual hub network is created by the intermediary server and electrically connected to both the authentication box and the connecting apparatus such that the connecting apparatus is authenticated by authentication box based on the authentication information.

Abstract: The present disclosure relates to a data retention method which ensures security of classified information in design. The data retention method comprises steps as follows: a data plug of a dedicated storage module is inserted into a data socket of an encryption module and a locking element of a lock fastener module is fixed at a locking hole on the dedicated storage module; the encryption module and the dedicated storage module are electrically connected to each other through the data socket; an external component of the encryption module is electrically connected to an external device such that classified information (saved or to be saved) is encrypted or decrypted between the external device and a storage element of the dedicated storage module by an encryption component of the encryption module during data exchanges.

Abstract: The present application relates to a storage device with a message projection function such that image light from an image generation unit of an information outlet, which has been electrically connected with an dedicated storage module, passes through and is diffused by a diffusion unit for projection of a created virtual image on a surface.

Abstract: The present disclosure relates to a method for connections of peer devices with features: a first peer box produces authentication information which will be saved in an authentication storage module and comprises a network location and an encryption key of the first peer box; the authentication storage module is electrically connected with a second peer box such that both the network location and the encryption key of the first peer box are received by the second peer box through the authentication information; both the network location and the encryption key of the second peer box are added into the authentication information in the authentication storage module from the second peer box; finally, the authentication storage module is electrically connected with a third peer box such that both the network locations and the encryption keys of the former peer boxes are received by the third peer box through the authentication information.

Abstract: The present disclosure relates to a method to change the capacity of a storage device through which the capacity of an external storage device is increased as required without payment of extra charges in the beginning. In the method, a standard capacity sector only is accessed through a data access interface; then, an authorization code for dedicated unlock software is entered for electrical connection to an authorization module through a data access interface and one capacity expansion sector accessed based on the authorization code; finally, both a standard capacity sector and a capacity expansion sector are accessed through the data access interface.

Abstract: The present disclosure relates to a transaction authentication method in which a process for transaction safety is created: a consumption confirmation is sent to an authentication box from a transaction platform on which a user has a customer behavior through the internet; the authentication box notifies the user based on a default configuration; the user replies the authentication box by confirmed information; a dedicated confirmation code is replied to the transaction platform from the authentication box and the customer behavior of the user is approved by the transaction platform.

Abstract: The present disclosure relates to a device authentication method as a procedure designed for authenticity of an apparatus. A connecting apparatus to be authenticated and an authentication box are connected to a trusted network through which authentication information is received by the connecting apparatus. The connecting apparatus is electrically connected to a non-trusted network through which the connecting apparatus and an intermediary server are electrically connected with each other; a virtual hub network is created by the intermediary server and electrically connected to both the authentication box and the connecting apparatus such that the connecting apparatus is authenticated by authentication box based on the authentication information.

Abstract: A data exchange guide device and an execution method thereof provided in the present disclosure are characterized that a processing program, which is executed by an electronic device connected with a connection interface, is able to read private key information, access a tabulation of remote shared data from an existing network available to the electronic device, and display the tabulation on a graphic user interface. Furthermore, a data exchange guide device and an execution method thereof provided in the present disclosure are also characterized that a processing program, which is executed by an electronic device connected with the connection interface and a virtual network card, is able to read private key information, access a tabulation of remote shared data from the virtual network card, and display the tabulation on a graphic user interface.

Abstract: The present disclosure relates to a data retention method which ensures security of classified information in design. The data retention method comprises steps as follows: a data plug of a dedicated storage module is inserted into a data socket of an encryption module and a locking element of a lock fastener module is fixed at a locking hole on the dedicated storage module; the encryption module and the dedicated storage module are electrically connected to each other through the data socket; an external component of the encryption module is electrically connected to an external device such that classified information (saved or to be saved) is encrypted or decrypted between the external device and a storage element of the dedicated storage module by an encryption component of the encryption module during data exchanges.

Abstract: The present disclosure relates to a data retention device designed for security of digital classified information. In the data retention device, a power source component is first activated by a fingerprint switch. When a data plug of a dedicated storage module and a data socket of an encryption module are connected with each other, a locking element in the encryption module is fixed at a locking hole in the dedicated storage module and the encryption module is electrically connected to the dedicated storage module through the data socket. Then, with an external component of the encryption module electrically connected to an external device, classified information is accessed, encrypted in the encryption module and saved in the storage element.

Abstract: The present disclosure relates to a data exchange group system and a method thereof which features: a shared file is saved in a file storage space of a storage device via the internet and also recorded in an intrinsic file list of the storage device; the shared file is configured to be shared in the storage device and also recorded in a shared file list of the storage device; the shared file is configured to be queried in a transaction system and recorded in a group file list of the storage device; the shared file encrypted and authorized in the transaction system is received by a data recipient through an encrypted file connection for the shared file of the storage device.

Abstract: A rectangular semiconductor package and a method manufacturing the same described in the present disclosure features no carrier installed on a die cut from a wafer. In an embodiment, a first die on a top surface of a conductive routing layer is electrically connected to the conductive routing layer through a plurality of first metal wires, a plurality of conductive balls is installed on a bottom surface of the conductive routing layer, and a molding compound is used to encase the first die on the conductive routing layer. In another embodiment, a second die is added in the above rectangular semiconductor package and encased in the molding compound, as is the first die. Alternatively, the molding compound is processed such that the second die encapsulated in a package is stacked on the molding compound and electrically connected to the conductive routing layer.

Abstract: A data exchange guide device and an execution method thereof provided in the present disclosure are characterized that a processing program, which is executed by an electronic device connected with a connection interface, is able to read private key information, access a tabulation of remote shared data from an existing network available to the electronic device, and display the tabulation on a graphic user interface. Furthermore, a data exchange guide device and an execution method thereof provided in the present disclosure are also characterized that a processing program, which is executed by an electronic device connected with the connection interface and a virtual network card, is able to read private key information, access a tabulation of remote shared data from the virtual network card, and display the tabulation on a graphic user interface.

Abstract: A device pairing method relates to steps of transmitting authentication information to a second device from a first device via a physical connecting line. First, a connectivity interface on the second device is electrically connected to an authentication connectivity interface on the first device via a connecting line; second, the first device in the mode of the virtual authentication disk is electrically connected to the second device; third, authentication information in the virtual authentication disk is accessed by an application program of the second device; fourth, an electrical connection between the second device and the first device is disabled with the connecting line removed; finally, the first device is accessed by the application program of the second device when the authentication information is transmitted to a network interface on the first device through some wireless networks of the second device.

Abstract: A rectangular semiconductor package and a method manufacturing the same described in the present disclosure features no carrier installed on a die cut from a wafer. In an embodiment, a first die on a top surface of a conductive routing layer is electrically connected to the conductive routing layer through a plurality of first metal wires, a plurality of conductive balls is installed on a bottom surface of the conductive routing layer, and a molding compound is used to encase the first die on the conductive routing layer. In another embodiment, a second die is added in the above rectangular semiconductor package and encased in the molding compound, as is the first die. Alternatively, the molding compound is processed such that the second die encapsulated in a package is stacked on the molding compound and electrically connected to the conductive routing layer.