Patents Assigned to Wentworth Mold Inc.
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Patent number: 7025584Abstract: A base assembly used as a part of a mold assembly for forming a container has a base insert and a flow divider plate that co-operate to define a continuous fluid passageway for cooling or heating the base insert. The flow divider plate has an upper surface portion having at least one raised runway extending in a first pattern covering a substantial area of the upper surface portion. The base insert has a lower surface portion with a continuous channel extending in a second pattern. The channel is positioned adjacent the at least one raised runway in sealing relation therewith to define a continuous fluid passageway.Type: GrantFiled: August 29, 2003Date of Patent: April 11, 2006Assignee: Wentworth Mold Inc.Inventor: Tar Tsau
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Patent number: 6994542Abstract: A mold half carrier has first and second air flow compensating surface areas. The second air flow compensating surface area encloses the first air flow compensating surface area. The first air flow compensating surface area provides pressure compensation for formation of smaller containers. Both air flow compensating surface areas are utilized for formation of larger containers. A shut off valve controls air flow through a passage in the mold carrier extending between the first and second air flow compensating surface areas. The second air flow compensating surface area has an exhaust passage for bleeding unwanted pressurized air therefrom when the shut off valve is closed. The compensating surface areas are separated from each other by a common continuous groove and an O-ring mounted in the groove. The groove has an arcuate main portion for receiving the O-ring and an auxiliary portion into which a portion of the O-ring may collapse.Type: GrantFiled: December 30, 2003Date of Patent: February 7, 2006Assignee: Wentworth Mold Inc.Inventors: Tar Tsau, Reinhold Ernst Nitsche, Kyi San Kyi
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Patent number: 6948924Abstract: A mold assembly for forming a container has two modular mold half shells that are adapted to be surrounded by mold half carriers. Each modular mold half shell has an upper body mold section and at least one lower body mold section. The upper body mold sections of the mold half shells are releasably secured in vertical registry with the mold half carriers. The upper body mold sections have upper inner walls defining an upper cavity whose shape corresponds to an upper portion of the container to be formed. The modular mold half shell have at least one lower body mold section and preferably multiple interchangeable lower body mold sections that are releasably secured with the upper body mold section. The lower body mold sections have lower inner walls defining a lower cavity whose shape corresponds to a lower portion of the container to be formed.Type: GrantFiled: April 11, 2003Date of Patent: September 27, 2005Assignee: Wentworth Mold Inc.Inventors: Tar Tsau, Reinhold Ernst Nitsche, Kyi San Kyi
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Patent number: 6913455Abstract: A hot fill hot fill mold assembly has two mold half shells and two mold half carriers for supporting the mold half shells. The shells each have an inner wall that defines the shape of at least a portion of the container to be formed. Each shell has outer wall surface portions and a plurality of spaced apart slotted grooves extending between the outer wall surface portions that define open air spaces recessed from the outer wall portions. The mold half carriers have a carrier inner wall that overlays in contacting and thermal conducting relation the outer wall surface portions of a corresponding one of the mold half shells and overlays the spaced apart slotted grooves to create thermal buffering open air pockets between the mold half shells and the mold half carriers so as to reduce the thermal conduction away from the mold face and improve hot fill container formation.Type: GrantFiled: April 11, 2003Date of Patent: July 5, 2005Assignee: Wentworth Mold Inc.Inventors: Tar Tsau, Reinhold Ernst Nitsche, Kyi San Kyi
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Publication number: 20050142243Abstract: A mold half carrier has first and second air flow compensating surface areas. The second air flow compensating surface area encloses the first air flow compensating surface area. The first air flow compensating surface area provides pressure compensation for formation of smaller containers. Both air flow compensating surface areas are utilized for formation of larger containers. A shut off valve controls air flow through a passage in the mold carrier extending between the first and second air flow compensating surface areas. The second air flow compensating surface area has an exhaust passage for bleeding unwanted pressurized air therefrom when the shut off valve is closed. The compensating surface areas are separated from each other by a common continuous groove and an O-ring mounted in the groove. The groove has an arcuate main portion for receiving the O-ring and an auxiliary portion into which a portion of the O-ring may collapse.Type: ApplicationFiled: December 30, 2003Publication date: June 30, 2005Applicant: Wentworth Mold Inc.Inventors: Tar Tsau, Reinhold Nitsche, Kyi Kyi
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Publication number: 20050048155Abstract: A base assembly used as a part of a mold assembly for forming a container has a base insert and a flow divider plate that co-operate to define a continuous fluid passageway for cooling or heating the base insert. The flow divider plate has an upper surface portion having at least one raised runway extending in a first pattern covering a substantial area of the upper surface portion. The base insert has a lower surface portion with a continuous channel extending in a second pattern. The channel is positioned adjacent the at least one raised runway in sealing relation therewith to define a continuous fluid passageway. The channel in the base insert is a recessed groove and a plurality of bores with dome shaped ends that extend from the lower surface portion of the base insert deeper into the base insert than the recessed groove. The raised runway has a plurality of baffles with rounded tips that extend outwardly therefrom and into a corresponding one of the bores to redirect flow of fluid through the bores.Type: ApplicationFiled: August 29, 2003Publication date: March 3, 2005Applicant: Wentworth Mold Inc.Inventor: Tar Tsau
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Publication number: 20040202746Abstract: A mold assembly for forming a container has two modular mold half shells that are adapted to be surrounded by mold half carriers. Each modular mold half shell has an upper body mold section and at least one lower body mold section. The upper body mold sections of the mold half shells are releasably secured in vertical registry with the mold half carriers. The upper body mold sections have upper inner walls defining an upper cavity whose shape corresponds to an upper portion of the container to be formed. The modular mold half shell have at least one lower body mold section and preferably multiple interchangeable lower body mold sections that are releasably secured with the upper body mold section. The lower body mold sections have lower inner walls defining a lower cavity whose shape corresponds to a lower portion of the container to be formed.Type: ApplicationFiled: April 11, 2003Publication date: October 14, 2004Applicant: Wentworth Mold Inc.Inventors: Tar Tsau, Reinhold Ernst Nitsche, Kyi San Kyi
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Publication number: 20040202745Abstract: A hot fill hot fill mold assembly has two mold half shells and two mold half carriers for supporting the mold half shells. The shells each have an inner wall that defines the shape of at least a portion of the container to be formed. Each shell has outer wall surface portions and a plurality of spaced apart slotted grooves extending between the outer wall surface portions that define open air spaces recessed from the outer wall portions. The mold half carriers have a carrier inner wall that overlays in contacting and thermal conducting relation the outer wall surface portions of a corresponding one of the mold half shells and overlays the spaced apart slotted grooves to create thermal buffering open air pockets between the mold half shells and the mold half carriers so as to reduce the thermal conduction away from the mold face and improve hot fill container formation.Type: ApplicationFiled: April 11, 2003Publication date: October 14, 2004Applicant: Wentworth Mold Inc.Inventors: Tar Tsau, Reinhold Ernst Nitsche, Kyi San Kyi
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Patent number: 6767497Abstract: A release mechanism operating to release molded articles from a third mold portion includes a guide coupled to the second mold portion forming a cam track. A cam follower coupled to the surfaces of the third mold portion, which are holding the molded articles, is engaged in the cam track when the second and third mold portions are within a pre-selected distance of each other. The cam follower interacts with the cam track to cause some initial movement of the surfaces holding the molded articles to a pre-release position for the holding surfaces so that the molded articles are loosely retained by the holding surfaces. A power operator, carried by the third mold portion and coupled to the article holding surfaces, is responsive to a signal to move the article holding surfaces from the pre-release position to a full release position when a molded article receiver is suitably positioned to receive the molded articles. The molded article receiver includes receiver tubes for receiving the molded articles.Type: GrantFiled: November 20, 2001Date of Patent: July 27, 2004Assignee: Wentworth Mold, Inc., Electra Form Industries DivisionInventors: Carl L Knepper, David P. Meiring
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Patent number: 6461141Abstract: An adjustable cam track for a mold assembly including a first mold portion, a second mold portion movable with respect to the first mold portion, a third mold portion movably interposed between the first and second portions and having at least one pair of space defining surfaces which together with the first and second mold portions defines in a closed position space for receiving plastic material to form at least one molded article. The adjustable cam track includes a guide coupled to the second mold portion, the guide defining a first portion of the adjustable cam track and a cam insert including a second portion of the adjustable cam track defining a point of release of the molded article from the space defining surfaces, the cam insert being adjustably positionable with respect to the guide to adjust the point of release.Type: GrantFiled: November 30, 2000Date of Patent: October 8, 2002Assignee: Wentworth Mold, Inc., Electra Form Industries DivisionInventors: Kevin R. Harrison, Jeffrey P. Roark
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Patent number: 6428302Abstract: A mold assembly has two mold half shells, corresponding mold half carriers, and a novel intermediate interconnecting member comprising a pair of ring shaped locating members. The locating members have an inner locating wall, preferably a stepped shoulder, that fits into a recessed slot in the outer wall of the mold shells. The locating members have an outer wall that fits into a recessed slot in the inner wall of the mold half carriers. The inner and outer locating walls of the locating members are vertically positioned relative to each to determine the vertical registry of the mold shell to the mold carrier. By utilizing intermediate interconnecting members of differing relative vertical positioning of the inner and outer locating walls, universals mold shells and mold carriers may be used for containers having differing neck heights whereby the neck height adjustment is accommodated by changing the intermediate interconnecting member.Type: GrantFiled: September 14, 2000Date of Patent: August 6, 2002Assignee: Wentworth Mold Inc.Inventor: Tar Tsau