Patents Assigned to Westech Systems, Inc.
  • Conditioner for a polishing pad and method therefor
    Patent number: 5456627
    Abstract: An axially rotating circular polishing pad is conditioned by a rotating end effector that has an abrasion disc in contact with a polishing surface of the pad. The end effector moves along a radius of the polishing pad surface at a velocity that varies to compensate for locations on the polishing pad surface having linear velocities that are directly related to their respective radii. A desired contact force is maintained between the end effector and the polishing pad surface.
    Type: Grant
    Filed: December 20, 1993
    Date of Patent: October 10, 1995
    Assignee: Westech Systems, Inc.
    Inventors: Paul D. Jackson, Stephen C. Schultz, James E. Sanford, Glen Ong, Richard B. Rice, Parag S. Modi, John G. Baca
  • Semiconductor wafer carrier and method
    Patent number: 5423558
    Abstract: An improved semiconductor wafer carrier provides gimballing motion of the wafer to dynamically align the wafer to a polishing platen. This gimballing motion is achieved by providing a conical receptacle which has a spring friction fit with a spherical button. A torque plate with spring fingers provides the spring friction fit between the conical receptacle on the rotating shaft and the spherical button on the drive plate of the wafer carrier.
    Type: Grant
    Filed: March 24, 1994
    Date of Patent: June 13, 1995
    Assignee: IPEC/Westech Systems, Inc.
    Inventors: Joe E. Koeth, Melvin J. Hoffman, Paul D. Jackson
  • Apparatus for interlayer planarization of semiconductor material
    Patent number: 5257478
    Abstract: A pad for planarizing the surface of a semiconductor wafer. The pad includes at least two layers. One layer has a hydrostatic modulus which is different from the hydrostatic modulus of the other pad.
    Type: Grant
    Filed: January 31, 1992
    Date of Patent: November 2, 1993
    Assignees: Rodel, Inc., Westech Systems, Inc.
    Inventors: Thomas C. Hyde, John V. H. Roberts
  • Cleaning brush for semiconductor wafer
    Patent number: 5144711
    Abstract: Apparatus for cleaning an offset semiconductor wafer includes first and second opposed brushes circumscribing a common drive shaft. The wafer includes a circular peripheral edge. At any given instant, a first portion of the offset semiconductor wafer is positioned between and contacts the brushes while the second remaining portion of the semiconductor wafer extends outwardly from between the brushes. The peripheral edge of the second portion of the wafer contacts and is turned by a rotating support member.
    Type: Grant
    Filed: March 25, 1991
    Date of Patent: September 8, 1992
    Assignee: Westech Systems, Inc.
    Inventor: Gerald L. Gill, Jr.
  • Apparatus for transporting wafer to and from polishing head
    Patent number: 5095661
    Abstract: Apparatus for transporting a wafer into position against the pressure head of apparatus for polishing the wafer. The transport apparatus includes a dolly for positioning a wafer over a transport head assembly. The transport head assembly removes the wafer from the dolly and positions the wafer against the pressure head. When the transport head assembly removes the wafer from the dolly and positions the wafer against the pressure head, the transport head assembly only contacts the wafer at selected points at the periphery of the wafer.
    Type: Grant
    Filed: December 18, 1989
    Date of Patent: March 17, 1992
    Assignee: Westech Systems, Inc.
    Inventors: Gerald L. Gill, Jr., Thomas C. Hyde
  • Apparatus for transporting wafer to and from polishing head
    Patent number: 4944119
    Abstract: Apparatus for transporting a wafer into position against the pressure head of apparatus for polishing the wafer. The transport apparatus includes a dolly for positioning a wafer over a transport head assembly. The transport head assembly removes the wafer from the dolly and positions the wafer against the pressure head. When the transport head assembly removes the wafer from the dolly and positions the wafer against the pressure head, the transport head assembly only contacts the wafer at selected points at the periphery of the wafer.
    Type: Grant
    Filed: June 20, 1988
    Date of Patent: July 31, 1990
    Assignee: Westech Systems, Inc.
    Inventors: Gerald L. Gill, Jr., Thomas C. Hyde