Abstract: A semiconductor package has a substrate with a plurality of contact pads. A first semiconductor die is mounted to the substrate. First bond wires are formed between each of the center-row contact pads of the first semiconductor die and the substrate contact pads. The first bond wires include an electrically insulative coating formed over the shaft that covers a portion of a surface of a bumped end of the first bond wires. An epoxy material is deposited over the first semiconductor die. A second semiconductor die is mounted to the epoxy material. Second bond wires are formed between each of the center-row contact pads of the second semiconductor die and the substrate contact pads. The second bond wires include an electrically insulative coating formed over the shaft of the second bond wires that covers a portion of a surface of a bumped end of the second bond wires.

Abstract: A method of producing a microelectronic device resistant to tampering, inspection and damage from surrounding environment or operating conditions includes: (i) applying an adhesion layer on a circuit including a die fixed and electrically connected to a laminate substrate; (ii) spraying, through a flame spray process, a tamper resistant coating over the applied adhesion layer; (iii) applying a first encapsulant for filling spaces and air pockets; (iv) removing air and gases from the first encapsulant; and (v) applying a second encapsulant around the first encapsulant for providing a moisture barrier 42 and handling surfaces for the microelectronic device.

Abstract: A semiconductor package has a substrate with a plurality of contact pads. A first semiconductor die is mounted to the substrate. First wire bonds are formed between each of the center-row contact pads of the first semiconductor die and the substrate contact pads. The first wire bonds include an electrically insulative coating formed over the shaft that covers a portion of a surface of a bumped end of the first wire bonds. An epoxy material is deposited over the first semiconductor die. A second semiconductor die is mounted to the epoxy material. Second wire bonds are formed between each of the center-row contact pads of the second semiconductor die and the substrate contact pads. The second wire bonds include an electrically insulative coating formed over the shaft of the second wire bonds that covers a portion of a surface of a bumped end of the second wire bonds.

Abstract: A semiconductor package has a substrate with a plurality of contact pads. A first semiconductor die is mounted to the substrate. First wire bonds are formed between each of the center-row contact pads of the first semiconductor die and the substrate contact pads. The first wire bonds include an electrically insulative coating formed over the shaft that covers a portion of a surface of a bumped end of the first wire bonds. An epoxy material is deposited over the first semiconductor die. A second semiconductor die is mounted to the epoxy material. Second wire bonds are formed between each of the center-row contact pads of the second semiconductor die and the substrate contact pads. The second wire bonds include an electrically insulative coating formed over the shaft of the second wire bonds that covers a portion of a surface of a bumped end of the second wire bonds.

Abstract: An LED backlight controller is disclosed. One embodiment comprises a luminance regulator to generate a luminance control signal to adjust a luminance level in a LED backlight assembly, a timing controller to generate a dimming control signal to adjust a dimming level in the LED backlight assembly, wherein the dimming control signal is a pulse width modulated signal, and an LED driver circuit to receive the luminance control signal and the dimming control signal, the LED driver circuit further to generate an LED driver signal to provide to the LED backlight assembly, wherein the LED driver circuit is configured to control luminance by adjusting the current of the LED driver signal, and wherein the LED driver circuit is configured to adjust a dimming level in the LED backlight assembly by a change in the duty cycle for the dimming control signal. Other embodiments are described herein.

Abstract: A secure storage system includes a storage device having a communication device and a memory. The communication device is for polling a communication medium. A security token is received from the communication medium via the communication device of the storage device. The security token received from the communication medium is compared to a second security token stored on the storage device. In one embodiment, a current location of the storage device is determined. The current location of the storage device is compared to an approved security zone. Access to the memory is provided if the security token received from the communication medium matches the second security token stored on the storage device and the current location of the storage device lies within the approved security zone. A time-out counter is set to a non-zero value after access to the memory is provided.

Abstract: A system for applying a sprayed coating includes a spray mechanism operative to spray a liquefied coating material; a target system including a rotatable spray target wheel; and one or more device-holding fixtures configured to be mounted onto the spray target wheel without requiring either an unattached threaded fastener or a locking pin. Preferred embodiments of the system are configured for thermal spray application of Tamper Resistant Coatings (TRCs).

Abstract: An input system is delineated comprising an array of touch regions. At least one touch region is aligned with a sensing structure. The sensing structure comprises a first conductive region; a second conductive region aligned with the first conductive region, the second conductive region including a first conductive pattern forming a first switch terminal and a second conductive pattern forming a second switch terminal, the first conductive pattern separated by a space from the second conductive pattern; and a third conductive region between the first conductive region and the second conductive region, the third conductive region electrically coupling the first switch terminal to the second switch terminal to provide a first indication when the switch is open and a second indication when the switch is closed. Also delineated is a control panel including a plurality of such switches, as well as an appliance including such a control panel.

Abstract: A switch is delineated comprising a first conductive region; a second conductive region aligned with the first conductive region, the second conductive region including a first conductive pattern forming a first switch terminal and a second conductive pattern forming a second switch terminal, the first conductive pattern separated by a space from the second conductive pattern; and a third conductive region between the first conductive region and the second conductive region, the third conductive region electrically coupling the first switch terminal to the second switch terminal to provide a first indication when the switch is open and a second indication when the switch is closed. Also delineated is a control panel including a plurality of such switches, as well as an appliance including such a control panel.

Abstract: A system for applying a sprayed coating includes a spray mechanism operative to spray a liquefied coating material; a target system including a rotatable spray target wheel; and one or more device-holding fixtures configured to be mounted onto the spray target wheel without requiring either an unattached threaded fastener or a locking pin. Preferred embodiments of the system are configured for thermal spray application of Tamper Resistant Coatings (TRCs).

Abstract: A switch comprising one or more keys mounted on a mat is disclosed. Each of the one or more keys includes a top section, a bottom section and an undercut region formed between the top section, the bottom section and the mat. Each of the one or more keys having a conductive surface mounted on an underside of the one or more keys. The switch also includes a substrate having one or more switch circuits corresponding to each of the one or more keys. Each of the one or more keys is mounted over each of the switch circuits and wherein when each of the keys is depressed the conductive surface contacts the switch circuit and completes the circuit. The switch further includes a bezel having one or more openings corresponding to the one or more keys. Each of the one or more keys is mounted through the one or more openings such that the top section of each of the one or more keys is on a top surface of the bezel and the bezel is in the undercut region.

Abstract: An electronic stack module is disclosed comprising two or more substrates having upper and lower surfaces with one or more electronic components disposed on the surfaces and electrically connected to connector pads disposed in a predetermined pattern at the substrate edges. A plurality of clip leads are electrically attached to the connector pads, where each clip lead comprises a clip section, a standoff section of specified length, and a mounting section, the clip section configured to frictionally engage both upper and lower substrate surfaces. Stacking of substrates is accomplished by aligning and bonding clip sections of one substrate to corresponding mating sections of the adjacent substrate.