Abstract: A chipboard having bonded thereto a sheet metal lamination is disclosed. The sheet metal stretches and contracts in response to dimensional changes in the chipboard without becoming detached therefrom, thereby improving and preserving the strength and integrity of the chipboard. Also disclosed is a method of manufacturing thin laminated chipboard wherein a thermoplastic material, securely connected or bonded to a sheet of non-thermoplastic material, is laminated to the chipboard by contacting the thermoplastic film against the chipboard while applying heat and pressure against the non-thermoplastic material.