Patents Assigned to Winbond Electronis Corporation
  • Patent number: 5659700
    Abstract: A method and apparatus for generating a modulo address for accessing a circular buffer. The method and apparatus accept as inputs a length L of the circular buffer, a current address A of the circular buffer, and an offset M between the current address and the next address to be generated. The offset M may be positive or negative. During operation of the present invention, the current address A first is broken down into a base address B and an offset from the base address a. Then, in accordance with the length L and the offset M, the invention determines an absolute offset and a wrapped offset. One of these offsets is added to the base address B to generate a next address for the circular buffer. The determination of which offset to add to the base address B is made by performing one of two comparisons.
    Type: Grant
    Filed: February 14, 1995
    Date of Patent: August 19, 1997
    Assignee: Winbond Electronis Corporation
    Inventors: Hwang-Chung Chen, Shih-Chang Hsu