Abstract: A touch panel and a method for fabricating the touch panel are presented. The touch panel includes a panel and a conductive border. A touch circuit is formed on a first side of the panel. A conductive border is formed on a circumference of the first side along the touch circuit. A method for fabricating the touch panel is further presented. The touch circuit of the touch panel is integrated onto the panel, so as to reduce the number of substrates that need to be bonded, thereby avoiding problems caused by substrate bonding and effectively decreasing the overall thickness of the touch panel.

Abstract: A touch panel is presented, which includes a first substrate, a second substrate, and a third substrate. The first substrate includes a first side having a first circuit. The second substrate includes a first side arranged on the first side of the first substrate and a second side having a second circuit. The third substrate is arranged on the second side of the second substrate. Therefore, by using the structure of the touch panel, the substrates of the touch panel can be integrated, so as to achieve the objective of decreasing the overall thickness of an electronic device.

Abstract: A touch panel and a method for fabricating the same are presented. The method includes the following steps. A glass substrate is strengthened through a chemical method. The glass substrate includes alkali oxide. An indium tin oxide (ITO) layer is formed below the glass substrate. A sensing circuit, a driving circuit, and an interconnection circuit therebetween are formed in the ITO layer.

Abstract: A touch panel is presented, which includes a first substrate, a second substrate, and a third substrate. The first substrate includes a first side having a first circuit. The second substrate includes a first side arranged on the first side of the first substrate and a second side having a second circuit. The third substrate is arranged on the second side of the second substrate. Therefore, by using the structure of the touch panel, the substrates of the touch panel can be integrated, so as to achieve the objective of decreasing the overall thickness of an electronic device.

Abstract: A substrate coating and a method of forming the same are provided. The substrate coating includes a first layer formed on a substrate, in which the composition of the first layer includes at least silicon-rich-carbon, and the amount of silicon is about equal to or greater than the amount of carbon; and a second layer formed on the first layer, in which the composition of the second layer includes at least fluorine doped diamond-like-carbon. The substrate coating not only is easy to clean, has good wearing performance, and provides a smooth surface, but also has better adhesion to prevent peeling off.

Abstract: A method for patterning a substrate is presented, which includes the following steps. A conductive material is jet-printed onto a part of at least one side of the substrate. A surface of the at least one side of the substrate is imprinted with a laser to pattern a first conductive pattern. By using the method, the process can be simplified and substrates of a touch panel can be integrated, so as to achieve an objective of decreasing the overall thickness of an electronic device.

Abstract: The present invention relates to touch panel and a fabrication method thereof. The method for forming touch panel disclosed in the present invention includes: forming a first pattern on a surface of a first substrate having a conductive material; forming a second pattern on a surface of a second substrate; aligning and laminating the first substrate having the first pattern and the second substrate; and cutting the laminated first substrate and second substrate into a plurality of touch panels. The present invention may resolve problems such as the high probability of substrate cracking and the high complexity of alignment of existing method for fabricating touch panel. A simple fabrication procedure may be used to perform alignment, to lamination and cutting, and the yield may be further improved.

Abstract: The subject invention relates to a light emitting device, including a first semiconductor layer having a first conductive type; a second semiconductor layer having a second conductive type, wherein the second conductive type is different from the first conductive type; and a passivation layer covering the first and the second semiconductor layers, wherein the passivation layer has a rough surface made from a roughing treatment. The subject invention further discloses a manufacturing method for such light emitting device. The structure of the light emitting device of the subject invention can eliminate unnecessary elements, reduce process time, facilitate control of light emitting shape and further improve light emitting efficiency.

Abstract: The subject invention relates to an illumination device, comprising a lamp holder having a base; and a plurality of LED dies directly bonded on the base. The structure of the illumination device of the subject invention can eliminate unnecessary elements, reduce process time and further improve lighting efficiency.

Abstract: A touch panel and a method for fabricating the same are presented. The method includes the following steps. A glass substrate is strengthened through a chemical method. The glass substrate includes alkali oxide. An indium tin oxide (ITO) layer is formed below the glass substrate. A sensing circuit, a driving circuit, and an interconnection circuit therebetween are formed in the ITO layer.

Abstract: A substrate coating and a method of forming the same are provided. The substrate coating includes a first layer formed on a substrate, in which the composition of the first layer includes at least silicon-rich-carbon, and the amount of silicon is about equal to or greater than the amount of carbon; and a second layer formed on the first layer, in which the composition of the second layer includes at least fluorine doped diamond-like-carbon. The substrate coating not only is easy to clean, has good wearing performance, and provides a smooth surface, but also has better adhesion to prevent peeling off.

Abstract: A touch panel is presented, which includes a first substrate, a second substrate, and a third substrate. The first substrate includes a first side having a first circuit. The second substrate includes a first side arranged on the first side of the first substrate and a second side having a second circuit. The third substrate is arranged on the second side of the second substrate. Therefore, by using the structure of the touch panel, the substrates of the touch panel can be integrated, so as to achieve the objective of decreasing the overall thickness of an electronic device.

Abstract: A method for patterning a substrate is presented, which includes the following steps. A conductive material is jet-printed onto a part of at least one side of the substrate. A surface of the at least one side of the substrate is imprinted with a laser to pattern a first conductive pattern. By using the method, the process can be simplified and substrates of a touch panel can be integrated, so as to achieve an objective of decreasing the overall thickness of an electronic device.

Abstract: A touch panel and a method for fabricating the touch panel are presented. The touch panel includes a panel and a conductive border. A touch circuit is formed on a first side of the panel. A conductive border is formed on a circumference of the first side along the touch circuit. A method for fabricating the touch panel is further presented. The touch circuit of the touch panel is integrated onto the panel, so as to reduce the number of substrates that need to be bonded, thereby avoiding problems caused by substrate bonding and effectively decreasing the overall thickness of the touch panel.