Abstract: There is provided a mounting arrangement for an integrated circuit chip carrier 7. The carrier 7 is retained in a holder 5 using the lateral forces created by the interference between leads 12 of the carrier and the walls 17 of the holder 5. A lid 6 is applied to the carrier 5 and leaf springs 3 are disposed in between. The lid 6 clips on to a circuit board 8 by virtue of barbed legs 4 and holes 11. The springs 3 urge the leads 12 against contact pads 9 on the circuit board 8.