Abstract: The invention is directed to a procedure for processing joints to be soldered, preferably printed circuit boards fitted with electric components, and an arrangement for executing this procedure, wherein the joints are subjected to plasma treatment before the soldering process. The joints may be subjected to plasma treatment separately or in the relative position necessary for the soldering process.
Type:
Grant
Filed:
November 5, 1990
Date of Patent:
March 9, 1993
Assignee:
WLS Karl-Heinz Grasmann Weichlotanlagen-und Service
Inventors:
Volker Liedke, Karl H. Grasmann, Hans-Jurgen Albrecht, Harald Wittrich, Wilfred John, Wolfgang Scheel