Abstract: A pump laser capable of delivering at least a specified amount of output power is described. The pump laser has an array of N semiconductor lasers each having a first wavelength and an individual available output power (P) such that the product of N times P is equal to or greater than the specified amount of output power. The pump laser also has a coupler configured to couple light emitted by the individual lasers in the array to an individual optical fiber.

Abstract: A method of integrating a chip with a topside active optical chip is described. The topside active optical chip has at least one optical laser device, having an active side including an optically active region, a laser cavity having a height, an optically inactive region, a bonding side opposite the active side, and a device thickness. The method involves bonding the optical chip to the electronic chip; applying a substrate to the active side, the substrate having a substrate thickness over the active region in the range of between a first amount and a second amount, and applying an anti-reflection without a special patterning or distinguishing between the at least one optical laser device and any other device. A hybrid electro-optical chip is also described as having an electronic chip; and a topside active optical chip. The hybrid electro-optical chip having been created by one of the methods herein. A module is also described.

Abstract: An optical unit has multiple optical devices, a collimated coupler disposed relative to the multiple optical devices so that laser light can be transferred between at least two of the multiple optical devices and the collimated coupler without crosstalk, and a fused glass collimator, disposed within the collimated coupler, having multiple optical fibers arranged in a predetermined arrangement relative to the multiple optical devices so that the number of optical fibers is always equal to or greater than the number of optical devices on a use basis.

Abstract: A female format connector, usable for connection with a male format connector having an alignment pin is described as having a high-precision piece coupled to a low precision piece. The low precision piece has an alignment opening dimensioned to accept the alignment pin of the male format device. The high-precision piece also has an alignment opening. The alignment openings are sized and positioned for accurate alignment between the pieces during coupling and, after coupling, the high-precision piece is modified such that the second alignment opening, after modification, is larger than it was prior to the coupling. A method of forming a female format ferrule involves coupling a high precision piece to a low precision piece, via alignment holes on each, the alignment holes are sized to accept a common alignment pin for maintaining accurate alignment between the pieces during coupling, and, after coupling, removing some of the alignment hole wall.

Abstract: A method of optimizing a feature, defined by a wall in a wafer material, to an accuracy of better than 1 micron involves treating the wall with a reactive gas, by exposing the wall to the reactive gas, to cause the wall to become a cladding material and expand outwards from the wall in a defined, uniform manner until a desired size for the feature is achieved. An alternative method of optimizing a feature, defined by a wall in a wafer material, to an accuracy of better than 1 micron involves depositing a base material on at least part of the wall to facilitate plating of a material on the wall, on top of the base material, in a defined, uniform manner, and plating the at least part of the wall with the material until a desired size for the feature is achieved.

Abstract: A method of integrating a chip with a backside active optical chip is described. The backside active optical chip has at least one optical device, having an active side, including an optically active region and an optically inactive region each abutting a substrate, a bonding side opposite the active side, and a device thickness. The method involves if the substrate has a substrate thickness in excess of 100 microns over the optically active region, thinning the substrate over the optically active region while leaving at least some substrate over the optically inactive region; bonding the optical chip to the electronic chip using a flip chip process; and creating access ways in the substrate over optically active regions. A hybrid electro-optical chip having an electronic chip and a backside active optical chip is also described, wherein the hybrid electro-optical chip is created by one of the described processes. A module is also described.

Abstract: A method of packaging an optical chip or an optical chip with an electronic chip that allows for close connections between the two chips. The method reduces parasitic capacitance and inductance, and provides unobstructed optical access while allowing for connection of a heat sink to the electronic chip for cooling.

Abstract: A method of forming a guide for light in a high refractive index material involves forming a guiding structure into a surface of the material, treating the material with a reactive gas to cause the wall to become a cladding material having a relatively low refractive index, and after treating, filling the cavity with an optically transparent material having a refractive index sufficiently above that of the cladding. A light guiding device is also described. The light guiding device has a slab having a high refractive index, a guide located within the slab. The guide has a wall surface covered with a material, derived from the slab, having a first refractive index lower than the high refractive index, and a filler material having a second refractive index sufficiently higher than the first refractive index such that light entering the guide will be directed towards the second end.

Abstract: A ferrule has a body, peripherally dimensioned for receipt within a commercially available fiber optic connector, the body has a forward portion comprising a front side and a rear side, the front side defining a face of the ferrule, the rear side defining an inner surface. The forward portion has a large format array of fiber holes, each of the fiber holes in the array extending between the front side and the rear side and being sized to accept an optical fiber inserted therein, and the forward portion having a thickness, T, less than 3000 microns but at least a minimum thickness sufficient to support optical fibers inserted into the fiber holes. An optical connector, having a ferrule, and a fiber optic cable assembly are also described.